© Semiconductor Components Industries, LLC, 2014
November, 2014 − Rev. 9
1 Publication Order Number:
NB6L11S/D
NB6L11S
2.5 V 1:2 AnyLevel] Input
to LVDS Fanout Buffer /
Translator
The NB6L11S is a differential 1:2 clock or data receiver and will
accept AnyLevel input signals: LVPECL, CML, LVCMOS, LVTTL,
or LVDS. These signals will be translated to LVDS and two identical
copies of Clock or Data will be distributed, operating up to 2.0 GHz or
2.5 Gb/s, respectively. As such, the NB6L11S is ideal for SONET,
GigE, Fiber Channel, Backplane and other Clock or Data distribution
applications.
The NB6L11S has a wide input common mode range from
GND + 50 mV to V
CC
50 mV. Combined with the 50 W internal
termination resistors at the inputs, the NB6L11S is ideal for translating
a variety of differential or single−ended Clock or Data signals to
350 mV typical LVDS output levels.
The NB6L11S is the 2.5 V version of the NB6N11S and is offered in
a small 3 mm X 3 mm 16−QFN package. Application notes, models,
and support documentation are available at www.onsemi.com
.
Features
Input Clock Frequency > 2.0 GHz
Input Data Rate > 2.5 Gb/s
RMS Clock Jitter −0.5 ps, Typical
622 Mb/s Data Dependent Jitter − 6 ps, Typical
380 ps Typical Propagation Delay
120 ps Typical Rise and Fall Times
Single Power Supply; V
CC
= 2.5 V " 5%
These are Pb−Free Devices
TIME (58 ps/div)
Figure 2. Typical Output Waveform at 2.488 Gb/s with
PRBS 2
23−1
(V
INPP
= 400 mV; Input Signal DDJ = 14 ps)
VOLTAGE (130 mV/div)
Device DDJ = 10 ps
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
MARKING
DIAGRAM*
QFN−16
MN SUFFIX
CASE 485G
www.onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
ORDERING INFORMATION
16
NB6L
11S
ALYW G
G
1
1
Q0
Q0
Q1
Q1
D
D
V
TD
V
TD
Figure 1. Logic Diagram
(Note: Microdot may be in either location)
NB6L11S
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2
Figure 3. NB6L11S Pinout, 16−pin QFN (Top View)
V
CC
NC V
EE
V
EE
V
CC
V
TD
D
D
V
TD
Q0
Q0
Q1
Q1
5678
16 15 14 13
12
11
10
9
1
2
3
4
NB6L11S
Exposed Pad (EP)
V
CC
V
CC
V
CC
Table 1. PIN DESCRIPTION
Pin Name I/O Description
1 Q0 LVDS Output
Non−inverted D output. Typically loaded with 100 W receiver termination
resistor across differential pair.
2 Q0 LVDS Output
Inverted D output. Typically loaded with 100 W receiver termination resistor
across differential pair.
3 Q1 LVDS Output
Non−inverted D output. Typically loaded with 100 W receiver termination
resistor across differential pair.
4 Q1 LVDS Output
Inverted D output. Typically loaded with 100 W receiver termination resistor
across differential pair.
5 V
CC
Positive Supply Voltage.
6 NC No Connect.
7 V
EE
Negative Supply Voltage.
8 V
EE
Negative Supply Voltage.
9 V
TD
Internal 50 W termination pin for D.
10 D LVPECL, CML, LVDS,
LVCMOS, LVTTL
Inverted Differential Clock/Data Input (Note 1).
11 D LVPECL, CML, LVDS,
LVCMOS, LVTTL
Non−inverted Differential Clock/Data Input (Note 1).
12 V
TD
Internal 50 W termination pin for D.
13 V
CC
Positive Supply Voltage.
14 V
CC
Positive Supply Voltage.
15 V
CC
Positive Supply Voltage.
16 V
CC
Positive Supply Voltage.
EP Exposed pad. The exposed pad (EP) on the package bottom must be
attached to a heat−sinking conduit. The exposed pad may only be
electrically connected to V
EE
.
1. In the differential configuration when the input termination pins (V
TD
, V
TD
) are connected to a common termination voltage or left open, and
if no signal is applied on D, D
input, then the device will be susceptible to self−oscillation.
NB6L11S
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3
Table 2. ATTRIBUTES
Characteristic Value
ESD Protection Human Body Model
Machine Model
Charged Device Model
> 2 kV
> 200 V
> 1 kV
Moisture Sensitivity (Note 2) Pb−Free Pkg
QFN−16 Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Transistor Count 225
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
2. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
V
CC
Positive Power Supply GND = 0 V 3.8 V
V
IN
Positive Input GND = 0 V V
IN
V
CC
3.8 V
I
IN
Input Current Through R
T
(50 W Resistor)
Static
Surge
35
70
mA
mA
I
OSC
Output Short Circuit Current
Line−to−Line (Q to Q
)
Line−to−End (Q or Q to GND)
Q or Q
Q to Q to GND
Continuous
Continuous
12
24
mA
T
A
Operating Temperature Range QFN−16 −40 to +85 °C
T
stg
Storage Temperature Range −65 to +150 °C
q
JA
Thermal Resistance (Junction−to−Ambient) (Note 3) 0 lfpm
500 lfpm
QFN−16
QFN−16
41.6
35.2
°C/W
°C/W
q
JC
Thermal Resistance (Junction−to−Case) 1S2P (Note 3) QFN−16 4.0 °C/W
T
sol
Wave Solder Pb−Free 265 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
3. JEDEC standard multilayer board − 1S2P (1 signal, 2 power) with 8 filled thermal vias under exposed pad.

NB6L11SMNG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Buffer HF LVDS FANOUT BUFF/ TRANS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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