MK5811SLF

DATASHEET
LOW EMI CLOCK GENERATOR MK5811
IDT™ / ICS™
LOW EMI CLOCK GENERATOR 1
MK5811 REV F 051310
Description
The MK5811 device generates a low EMI output clock from
a clock or crystal input. The device is designed to dither a
high emissions clock to lower EMI in consumer
applications. Using IDT’s proprietary mix of analog and
digital Phase Locked Loop (PLL) technology, the device
spreads the frequency spectrum of the output and reduces
the frequency amplitude peaks by several dB. The MK5811
offers both centered and down spread from a high-speed
clock input.
For different multiplier configurations, use the MK5812 (2x)
or MK5814 (4x).
IDT offers many other clocks for computers and computer
peripherals. Consult IDT when you need to remove crystals
and oscillators from your board.
Features
Packaged in 8-pin SOIC
Pb (lead) free package
Provides a spread spectrum output clock
Supports flat panel controllers
Accepts a clock or crystal input (provides same
frequency dithered output)
Input frequency range of 4 to 32 MHz
Output frequency range of 4 to 32 MHz
1X frequency multiplication
Center and down spread
Peak reduction by 8 dB to 16 dB typical on 3rd through
19th odd harmonics
Low EMI feature can be disabled
Operating voltage of 3.3 V
Advanced, low-power CMOS process
The MK5811A is recommended for new designs.
Block Diagram
PLL Clock
Synthesis
and Spread
Spectrum
Circuitry
S1:0
Spread Direction
FRSEL
SSCLK
2
GND
VDD
Clock Buffer/
Crystal
Ocsillator
X1/CLK
X2
The crystal requires external capacitors for
accurate tuning of the clock
MK5811
LOW EMI CLOCK GENERATOR SSCG
IDT™ / ICS™
LOW EMI CLOCK GENERATOR 2
MK5811 REV F 051310
Pin Assignment Spread Direction and Spread
Percentage
0 = connect to GND
M = unconnected (floating)
1 = connect directly to VDD
Frequency Selection
0 = connect to GND
M = unconnected (floating)
1 = connect directly to VDD
Note 1: The information in this datasheet does not apply to
the MK5812 and MK5814 as each have independent
datasheets available at www.idt.com.
X1/ICLK
GND
S1
VDD
S0
FRSEL
SSCLK
X21
2
3
4
8
7
6
5
8-pin (150 mil) SOIC
S1
Pin 3
S0
Pin 4
Spread
Direction
Spread
Percentage
0 0Center ±1.4
0 MCenter ±1.1
0 1Center ±0.6
M 0Center ±0.5
M M No Spread -
M 1 Down -1.6
1 0Down -2.0
1 MDown -0.7
1 1 Down -3.0
Product FRSEL
(pin 6)
Input
Freq. Range
Multiplier Output
Freq. Range
MK5811 0 4.0 to 8.0 MHz X1 4.0 to 8.0 MHz
1 8.0 to 16.0MHz X1 8.0 to 16.0MHz
M 16.0 to 32.0MHz X1 16.0 to 32.0MHz
MK5812
1
0 4.0 to 8.0 MHz X2 8.0 to 16.0MHz
1 8.0 to 16.0MHz X2 16.0 to 32.0MHz
M 16.0 to 32.0MHz X2 32.0 to 64.0MHz
MK5814
1
0 4.0 to 8.0 MHz X4 16.0 to 32.0MHz
1 8.0 to 16.0MHz X4 32.0 to 64.0MHz
M 16.0 to 32.0MHz X4 64.0 to 128MHz
MK5811
LOW EMI CLOCK GENERATOR SSCG
IDT™ / ICS™
LOW EMI CLOCK GENERATOR 3
MK5811 REV F 051310
Pin Descriptions
External Components
The MK5811 requires a minimum number of external
components for proper operation.
Decoupling Capacitor
A decoupling capacitor of 0.01µF must be connected
between VDD and GND on pins 7 and 2. Connect the
capacitor as close to these pins as possible. For optimum
device performance, mount the decoupling capacitor on the
component side of the PCB. Avoid the use of vias in the
decoupling circuit.
Series Termination Resistor
Use series termination when the PCB trace between the
clock output and the load is over 1 inch. To series terminate
a 50Ω trace (a commonly used trace impedance), place a
33Ω resistor in series with the clock line. Place the resistor
as close to the clock output pin as possible. The nominal
impedance of the clock output is 20Ω.
Tri-level Select Pin Operation
The S1 and S0 select pins are tri-level, meaning that they
have three separate states to make the selections shown in
the table on page 2. To select the M (mid) level, the
connection to these pins must be eliminated by either
floating them originally, or tri-stating the GPIO pins which
drive the select pins.
PCB Layout Recommendations
For optimum device performance and lowest output phase
noise, observe the following guidelines:
1) Mount the 0.01µF decoupling capacitor on the
component side of the board as close to the VDD pin as
possible. No vias should be used between the decoupling
capacitor and VDD pin. The PCB trace to the VDD pin and
the PCB trace to the ground via should be kept as short as
possible.
2) To minimize EMI, place the 33Ω series-termination
resistor (if needed) close to the clock output.
3) An optimum layout is one with all components on the
same side of the board, thus minimizing vias through other
signal layers. Other signal traces should be routed away
from the MK5811 device. This includes signal traces located
underneath the device, or on layers adjacent to the ground
plane layer used by the device.
Crystal Information
The crystal used should be a fundamental mode (do not use
third overtone), parallel resonant crystal. To optimize the
initial accuracy, connect crystal capacitors from pins X1 to
ground and X2 to ground. The value of these capacitors is
given by the following equation:
Crystal caps (pF) = (C
L
- 6) x 2
Pin
Number
Pin
Name
Pin Type Pin Description
1 X1/ICLK Input Connect to 4-32 MHz crystal or clock.
2 GND Power Connect to ground.
3 S1 Input Function select 1 input. Selects spread amount and direction per table above.
(default-internal mid-level).
4 S0 Input Function select 0 input. Selects spread amount and direction per table above.
(default-internal mid-level).
5 SSCLK Output Clock output with Spread spectrum
6 FRSEL Input Function select for input frequency range. Default to mid level “M”.
7 VDD Power Connect to +3.3 V.
8 X2 XO Crystal connection to 4-32 MHz crystal. Leave unconnected for clock

MK5811SLF

Mfr. #:
Manufacturer:
IDT
Description:
Clock Generators & Support Products LOW EMI CLOCK GENERATOR
Lifecycle:
New from this manufacturer.
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