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334-15/X2C3-1PSA

P1-P3P4-P6P7-P9P10-P12
Technical Data Sheet
334-15/X2C3-1PSA
Everlight Electronics Co., Ltd. http\\:www.everlight.com Rev 1 Page: 7 of 12
Device Number: DLE-0000702 Established date:01-06-2009 Established by: Ruby Lin
0 20 40 60 80
100
0
10
20
30
40
Forward Current(mA)
Ambient Temperature Ta(
O
C)
0
10
20
30
40
50
60
70
80
90
O
O
O
O
O
O
O
O
O
O
0
1.0
1.0
0.5
30
O
60
O
90
O
0.5
0
Relative Intensity(a.u.)
Radiation Angle
0 10 20 30 40 50
0.360
0.370
0.380
0.390
0.400
0.410
0.420
Chromaticity Coordinates
Forward Current(mA)
x
y
350 400 450 500 550 600 650 700 750 800
0.0
0.2
0.4
0.6
0.8
1.0
Relative Intensity
Wavelength(nm)
Typical Electro-Optical Characteristics Curves
Relative Intensity vs. Wavelength Forward Current vs. Forward Voltage
Relative Intensity vs. Forward Current Forward Current vs. Ambient Temp.
Chromaticity Coordinate vs. Forward Current Relative Intensity vs. Angle Dispacement
2.0 2.5 3.0 3.5 4.0 4.5
0
5
10
15
20
25
Forward Current(mA)
Forward Voltage(V)
0 5 10 15 20 25
0.0
0.5
1.0
1.5
Relative Intensity(a.u.)
Forward Current(mA)
Technical Data Sheet
334-15/X2C3-1PSA
Everlight Electronics Co., Ltd. http\\:www.everlight.com Rev 1 Page: 8 of 12
Device Number:
DLE-0000702
Established date:01-06-2009 Established by: Ruby Lin
Label
Packing Specification
Anti-electrostatic bag
Inner Carton
Label Form Specification
CPN: Customer’s Production Number
P/N : Production Number
QTY: Packing Quantity
CAT: Ranks of Luminous Intensity and Forward Voltage
HUE: Color Rank
Outside Carton REF: Reference
LOT No: Lot Number
MADE IN TAIWAN: Production Place
Packing Quantity
1. 500 PCS/1 Bag, 5 Bags/1 Inner Carton
2. 10 Inner Cartons/1 Outside Carton
Technical Data Sheet
334-15/X2C3-1PSA
Everlight Electronics Co., Ltd. http\\:www.everlight.com Rev 1 Page: 9 of 12
Device Number:
DLE-0000702
Established date:01-06-2009 Established by: Ruby Lin
Notes
1. Lead Forming
During lead formation, the leads should be bent at a point at least 3mm from the base of the
epoxy bulb.
Lead forming should be done before soldering.
Avoid stressing the LED package during leads forming. The stress to the base may damage
the LED’s characteristics or it may break the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures
may cause failure of the LEDs.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead
position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration
of the epoxy resin and this will degrade the LEDs.
2. Storage
The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from
Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or
more, they can be stored for a year in a sealed container with a nitrogen atmosphere and
moisture absorbent material.
Please avoid rapid transitions in ambient temperature, especially, in high humidity
environments where condensation can occur.
3. Soldering
Careful attention should be paid during soldering. When soldering, leave more then 3mm
from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is
recommended.
Recommended soldering conditions:
Hand Soldering DIP Soldering
Temp. at tip of
iron
300 Max.℃ (30W
Max.)
Preheat temp.
100 Max.℃ (60 sec
Max.)
Soldering time
3 sec Max.
Bath temp. & time 260 Max., 5 sec Max
Distance 3mm Min.(From
solder joint to
epoxy bulb)
Distance 3mm Min. (From
solder joint to epoxy
bulb)
P1-P3P4-P6P7-P9P10-P12

334-15/X2C3-1PSA

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Description:
Standard LEDs - Through Hole 5mm LED
Lifecycle:
New from this manufacturer.
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