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XEC24P3-30GR

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.
Model XEC24P3-30G
Rev B
Peak Power Handling
At Sealevel
High-Pot testing of these couplers during the qualification procedure resulted in a minimum breakdown
voltage of 1.44kV (minimum recorded value). This voltage level corresponds to a breakdown resistance capable of
handling at least 12dB peaks over average power levels, for very short durations. The breakdown location
consistently occurred across the air interface at the coupler contact pads (see illustration below). The breakdown
levels at these points will be affected by any contamination in the gap area around these pads. These areas must be
kept clean for optimum performance.
At High Altitudes
Breakdown voltage at high altitude reduces significantly comparing with the one at sea level. As an
example, plot below illustrates reduction in breakdown voltage of 1700 V at sea level with increasing altitude. The plot
uses Paschen’s Law to predict breakdown voltage variation over the air pressure.
It is recommended that the user test for voltage breakdown under the maximum operating conditions and over worst
case modulation induced power peaking. This evaluation should also include extreme environmental conditions (such
as high humidity) and physical conditions such as alignment of part to carrier board, cleanliness of carrier board etc.
Test Plan
Xinger couplers are manufactured in large panels and then separated. All parts are RF small signal tested and DC
tested for shorts/opens at room temperature in the fixture described above . (See “Qualification Flow Chart” section
for details on the accelerated life test procedures.)
Breakdown Voltage (Volts)
Altitude (ft)
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe
:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Model XEC24P3-30G
Rev B
Power Handling
The average power handling (total input power) of a Xinger coupler is a function of:
x Internal circuit temperature.
x Unit mounting interface temperature.
x Unit thermal resistance
x Power dissipated within the unit.
All thermal calculations are based on the following assumptions:
x The unit has reached a steady state operating condition.
x Maximum mounting interface temperature is 95
o
C.
x Conduction Heat Transfer through the mounting interface.
x No Convection Heat Transfer.
x No Radiation Heat Transfer.
x The material properties are constant over the operating temperature range.
Finite element simulations are made for each unit. The simulation results are used to calculate the unit thermal
resistance. The finite element simulation requires the following inputs:
x Unit material stack-up.
x Material properties.
x Circuit geometry.
x Mounting interface temperature.
x Thermal load (dissipated power).
The classical definition for dissipated power is temperature delta (
'T) divided by thermal resistance (R). The
dissipated power (P
dis
) can also be calculated as a function of the total input power (P
in
) and the thermal insertion loss
(IL
therm
):
)(101
10
WP
R
T
P
therm
IL
indis
¸
¸
¹
·
¨
¨
©
§
'
(1)
Power flow and nomenclature for an “H” style coupler is shown in Figure 1.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.
Model XEC24P3-30G
Rev B
Pin 1
Pin 4
Input Port
Coupled Port
Isolated Port
Direct Port
P
In
P
Out
(RL) P
Out
(DC)
P
Out
(CPL) P
Out
(ISO)
Figure 1
The coupler is excited at the input port with P
in
(watts) of power. Assuming the coupler is not ideal, and that there are
no radiation losses, power will exit the coupler at all four ports. Symbolically written, P
out(RL)
is the power that is
returned to the source because of impedance mismatch, P
out(ISO)
is the power at the isolated port, P
out(CPL)
is the
power at the coupled port, and P
out(DC)
is the power at the direct port.
At Anaren, insertion loss is defined as the log of the input power divided by the sum of the power at the coupled and
direct ports:
Note: in this document, insertion loss is taken to be a positive number. In many places, insertion loss is written as a
negative number. Obviously, a mere sign change equates the two quantities.
)dB(
PP
P
log10IL
)DC(out)CPL(out
in
10
¸
¸
¹
·
¨
¨
©
§
(2)
In terms of S-parameters, IL can be computed as follows:
)(log10
2
41
2
2110
dBSSIL
¸
¹
·
¨
©
§
(3)
We notice that this insertion loss value includes the power lost because of return loss as well as power lost to the
isolated port.
For thermal calculations, we are only interested in the power lost “inside” the coupler. Since P
out(RL)
is lost in the
source termination and P
out(ISO)
is lost in an external termination, they are not be included in the insertion loss for
thermal calculations. Therefore, we define a new insertion loss value solely to be used for thermal calculations:
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

XEC24P3-30GR

Mfr. #:
Buy XEC24P3-30GR
Manufacturer:
Anaren
Description:
RF DIR COUPLER 2.4GHZ-2.5GHZ SMD
Lifecycle:
New from this manufacturer.
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