BSS84_6 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 06 — 16 December 2008 3 of 11
NXP Semiconductors
BSS84
P-channel enhancement mode vertical DMOS transistor
5. Limiting values
[1] Device mounted on a Printed-Circuit Board (PCB).
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
drain-source voltage 25 °C T
j
150 °C-50 V
V
GS
gate-source voltage - ±20 V
I
D
drain current T
sp
=25°C; V
GS
= 10 V;
see
Figure 1
- 130 mA
T
sp
= 100 °C;
V
GS
= 10 V
- 75 mA
I
DM
peak drain current T
sp
=25°C; t
p
10 µs;
see
Figure 1
- 520 mA
P
tot
total power dissipation T
sp
=25°C; see Figure 2
[1]
- 250 mW
T
stg
storage temperature 65 +150 °C
T
j
junction temperature 65 +150 °C
T
sp
=25°C
(1) R
DSon
limitation
Fig 1. Safe operating area; continuous and peak drain currents as a function of drain-source voltage
mld251
V
DS
(V)
1 10
2
10
10
2
10
10
3
I
D
(mA)
1
1 ms
10 ms
100 ms
DC
(1)
t
p
=
10 µs
100 µs
BSS84_6 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 06 — 16 December 2008 4 of 11
NXP Semiconductors
BSS84
P-channel enhancement mode vertical DMOS transistor
6. Thermal characteristics
[1] Mounted on a PCB, vertical in still air.
Fig 2. Power derating curve
0 200
300
0
100
200
mld199
T
amb
(°C)
50 100 150
P
tot
(mW)
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
see Figure 3
[1]
- - 500 K/W
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration
1
10
10
3
10
2
t
p
(s)
110
mld250
R
th(j-a)
(K/W)
10
1
10
6
10
5
10
4
10
3
10
2
10
2
10
3
10
1
δ = 0.75
0.1
0
0.05
0.01
0.02
0.2
0.5
t
p
t
p
T
P
t
T
δ =
BSS84_6 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 06 — 16 December 2008 5 of 11
NXP Semiconductors
BSS84
P-channel enhancement mode vertical DMOS transistor
7. Characteristics
Table 7. Characteristics
T
j
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source breakdown
voltage
I
D
= 10 µA; V
GS
=0V 50--V
V
GS(th)
gate-source threshold
voltage
I
D
= 1 mA; V
DS
=V
GS
;
see
Figure 8
T
j
=25°C 0.8 - 2V
T
j
= 55 °C--1.8 V
I
DSS
drain leakage current V
DS
= 40 V; V
GS
=0V
T
j
=25°C--100 nA
V
DS
= 50 V; V
GS
=0V
T
j
=25°C--10 µA
T
j
= 125 °C--60 µA
I
GSS
gate leakage current V
GS
= +20 V; V
DS
= 0 V - - 100 nA
V
GS
= 20 V; V
DS
= 0 V - - 100 nA
R
DSon
drain-source on-state
resistance
V
GS
= 10 V;
I
D
= 130 mA;
see
Figure 5 and 7
-610
Dynamic characteristics
|Y
fs
| transfer admittance V
DS
= 25 V;
I
D
= 130 mA
50--mS
C
iss
input capacitance V
GS
=0V; V
DS
= 25 V;
f = 1 MHz; see
Figure 9
- 2545pF
C
oss
output capacitance - 15 25 pF
C
rss
reverse transfer
capacitance
- 3.5 12 pF
t
on
turn-on time V
DS
= 40 V; V
GS
=0V
to 10 V; I
D
= 200 mA;
see
Figure 10 and 11
-3-ns
t
off
turn-off time V
DS
= 40 V;
V
GS
= 10 V to 0 V;
I
D
= 200 mA;
see
Figure 10 and 11
-7-ns

BSS84,215

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET P-CH DMOS 50V 130MA
Lifecycle:
New from this manufacturer.
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