MPC8245 Hardware Specifications Addendum for the MPC8245ARXXnnnx Series, Rev. 3
2 Freescale Semiconductor
Electrical and Thermal Characteristics
4 Electrical and Thermal Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the
MPC8245.
4.1.1 Absolute Maximum Ratings
The tables in this section describe the MPC8245 DC electrical characteristics. Table 1 provides the
absolute maximum ratings.
Table A. Part Numbers Addressed in this Data Sheet
Freescale
Part No.
1
Operating Conditions
Significant Differences from
Hardware Specification
Processor
Version
Register
Value
CPU
Frequency
(MHz)
V
DD
T
J
(°C)
MPC8245ARZU400D
400 2.1 ± 100 mV 0 to 85
Modified voltage and temperature
specifications to achieve 400 MHz
0x80811014
MPC8245ARVV400D
Note:
The ‘A’ in the part number represents parts that are manufactured under a 29-angstrom process instead of the original
35-angstrom process. Package Options: ZU - TBGA, V V- Lead Free TBGA
Table 1. Absolute Maximum Ratings
Characteristic
1
Symbol Range Unit
Supply voltage—CPU core and peripheral logic V
DD
–0.3 to 2.2 V
Supply voltage—memory bus drivers GV
DD
–0.3 to 3.6 V
Supply voltage—PCI and standard I/O buffers OV
DD
–0.3 to 3.6 V
Supply voltage—PLLs AV
DD
/AV
DD
2 –0.3 to 2.2 V
Supply voltage—PCI reference LV
DD
–0.3 to 5.4 V
Input voltage
2
V
in
–0.3 to 3.6 V
Operational die-junction temperature range T
j
0 to 85 °C
Storage temperature range T
stg
–55 to 150 °C
Notes:
1. Table 2 shows functional and tested operating conditions. Absolute maximum ratings are stress ratings only, and functional
operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent
damage to the device.
2. PCI inputs with LV
DD
= 5 V ± 5% V DC may undergo corresponding stress at voltages exceeding LV
DD
+0.5VDC.
