MPC8245 Hardware Specifications Addendum for the MPC8245ARXXnnnx Series, Rev. 3
4 Freescale Semiconductor
Electrical and Thermal Characteristics
4.3.1 Clock AC Specifications
Figure 7 through Figure 10 show the DLL locking range loop delay vs. frequency of operation for
29 angstrom parts. These graphs define the areas of DLL locking for various modes. The gray areas show
where the DLL will lock.
I/O Power Supplies
10
Mode Range Unit Notes
Typ OV
DD
140–360 mW 7, 8
Typ GV
DD
340–920 mW 7, 9
Notes:
1. The values include V
DD
, AV
DD
, and AV
DD
2, but do not include I/O supply power.
2. Maximum—FP power is measured at V
DD
= 2.1 V with dynamic power management enabled while running an entirely
cache-resident, looping, floating point multiplication instruction.
3. Maximum—INT power is measured at V
DD
= 2.1 V with dynamic power management enabled while running entirely
cache-resident, looping, integer instructions.
4. Power saving mode maximums are measured at V
DD
= 2.1 V while the device is in doze, nap, or sleep mode.
5. Typical power is measured at V
DD
= AV
DD
= 2.1 V, OV
DD
= 3.3 V where a nominal FP value, a nominal INT value, and a
value where there is a continuous flush of cache lines with alternating ones and zeros on 64-bit boundaries to local memory
are averaged.
6. Power saving mode data measured with only two PCI_CLKs and two SDRAM_CLKs enabled.
7. The typical minimum I/O power values was the result of the MPC8245 performing cache resident integer operations at the
slowest frequency combination of 33:66:200 (PCI:Mem:CPU) MHz.
8. The typical maximum OV
DD
value resulted from the MPC8245 operating at the fastest frequency combination of 66:133:399
(PCI:Mem:CPU) MHz for the 400-MHz part, and performing continuous flushes of cache lines with alternating ones and
zeros to PCI memory.
9. The typical maximum GV
DD
value resulted from the MPC8245 operating at the fastest frequency combination of
66:133:399 (PCI:Mem:CPU) MHz for the 400-MHz part, and performing continuous flushes of cache lines with alternating
ones and zeros on 64-bit boundaries to local memory.
10. Power consumption of PLL supply pins (AV
DD
and AV
DD
2) < 15 mW that the design guarantees but were not tested.
Table 5. Power Consumption (continued)
Mode
PCI Bus Clock/Memory
Bus Clock
CPU Clock Frequency
(MHz)
Unit Notes
66/133/399
MPC8245 Hardware Specifications Addendum for the MPC8245ARXXnnnx Series, Rev. 3
Freescale Semiconductor 5
Electrical and Thermal Characteristics
Register settings that define each DLL mode are shown in Table 9.
The DLL_MAX_DELAY bit can lengthen the amount of time through the delay line. This is accomplished
by increasing the time between each of the 128 tap points in the delay line. Although this increased time
makes it easier to guarantee that the reference clock will be within the DLL lock range, it also means there
may be slightly more jitter in the output clock of the DLL, should the phase comparator shift the clock
between adjacent tap points. Refer to Freescale application note AN2164, MPC8245/MPC8241 Memory
Clock Design Guidelines:Part 1, for details about DLL modes and memory design.
The value of the current tap point once the DLL has locked can be determined by reading bits 6–0
(DLL_TAP_COUNT) of the DLL tap count register (DTCR, located at offset 0xE3). These bits store the
value (binary 0 through 127) of the current tap point and can indicate whether the DLL advances or
decrements as it maintains the DLL lock. Therefore, for evaluation purposes, DTCR can be read for all
DLL modes that support the T
loop
value that is used for the trace length of SDRAM_SYNC_OUT to
SDRAM_SYNC_IN. The DLL mode that provides the smallest tap point value seen in DTCR should be
used. This is because the bigger the tap point value, the more jitter that can be expected for clock signals.
Note that keeping a DLL mode that is locked below tap point 12 is not recommended.
Table 9. DLL Mode Definition
DLL Mode
Value of Bit 2 of Config
Register at 0x76
Value of Bit 7 of Config
Register at 0x72
Normal tap delay,
No DLL extend
00
Normal tap delay,
DLL extend
01
Max tap delay,
No DLL extend
10
Max tap delay,
DLL extend
11
MPC8245 Hardware Specifications Addendum for the MPC8245ARXXnnnx Series, Rev. 3
6 Freescale Semiconductor
Electrical and Thermal Characteristics
Figure 7. DLL Locking Range Loop Delay vs. Frequency of Operation for DLL_Extend = 0
and Normal Tap Delay
23
10
15
20
0
25
30
1
T
loop
Propagation Delay Time (ns)
T
clk
SDRAM_SYNC_OUT Period (ns)
N = 1
N = 2
7.5
4 5

KMPC8245ARZU400D

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC MPU MPC82XX 400MHZ 352TBGA MPC82xx
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