PCA8575_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 21 March 2007 19 of 30
NXP Semiconductors
PCA8575
Remote 16-bit I/O expander for I
2
C-bus with interrupt
14. Package outline
Fig 22. Package outline SOT137-1 (SO24)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1) (1)
eH
E
LL
p
Q
Z
ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT137-1
X
12
24
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
c
L
v M
A
13
(A )
3
A
y
0.25
075E05 MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.61
0.60
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
e
1
0 5 10 mm
scale
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
99-12-27
03-02-19
PCA8575_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 21 March 2007 20 of 30
NXP Semiconductors
PCA8575
Remote 16-bit I/O expander for I
2
C-bus with interrupt
Fig 23. Package outline SOT340-1 (SSOP24)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(1) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
0.65 1.25
7.9
7.6
0.9
0.7
0.8
0.4
8
0
o
o
0.13 0.10.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT340-1 MO-150
99-12-27
03-02-19
X
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
(A )
3
A
112
24 13
0.25
y
pin 1 index
0 2.5 5 mm
scale
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
A
max.
2
PCA8575_2 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 02 — 21 March 2007 21 of 30
NXP Semiconductors
PCA8575
Remote 16-bit I/O expander for I
2
C-bus with interrupt
Fig 24. Package outline SOT556-1 (SSOP24)
UNIT A
1
A
2
A
3
H
E
L
p
b
p
cD
(1)
E
(1)
Z
(1)
eL ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.25
0.10
1.55
1.40
0.25
0.31
0.20
0.25
0.18
8.8
8.6
4.0
3.8
0.635 1
6.2
5.8
0.89
0.41
1.05
0.66
8
0
o
o
8
0
o
o
0.180.25 0.1
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm (0.008 inch) maximum per side are not included.
SOT556-1
99-12-27
03-02-18
w M
b
p
D
H
E
E
Z
e
c
v M
A
X
A
y
1
12
24
13
θ
A
A
1
A
2
L
p
detail X
L
(A )
3
MO-137
0 2.5 5 mm
scale
SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm
SOT556-1
A
max.
1.73
inches
0.0098
0.0040
0.061
0.055
0.01
0.012
0.008
0.0098
0.0075
0.344
0.337
0.157
0.150
0.025 0.041
0.244
0.228
0.035
0.016
0.040
0.026
0.0070.01 0.004
0.068

PCA8575PW,112

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Interface - I/O Expanders 16-BIT I2C FM QB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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