10 REV. 1.0.5 7/22/04
FAN5009 PRODUCT SPECIFICATION
5. The paddle on the MLP package is internally referenced
to ground. It can be left floating or connected to ground.
For best thermal performance it should be connected to
ground as shown in Figure 7.
Figure 7. Recommended layout for MLP package.
Also accepts SO8 package (not to scale)
6. The recommended land pattern shown in the MLP
mechanical dimensions will work with both MLP-8
and SO-8 packages.
The circuit in Figure 1 illustrates a typical implementation
of a single phase of a multi-phase buck converter for V
CORE
applications. For a complete VR10 design example, please
refer to the FAN5019 or FAN5018 datasheets.
1
2
3
4
8
7
6
5
C
BOO
C
VCC
GROUND
VIAS
PADDLE
