REV. A–4–
AD8186/AD8187
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD8186/AD8187 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS
1, 2, 3, 4
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
DV
CC
to D
GND
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
DV
CC
to V
EE
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.0 V
V
CC
to D
GND
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.0 V
IN0A, IN0B, IN1A, IN1B, IN2A, IN2B, V
REF
. . . V
EE
≤ V
IN
≤ V
CC
SEL A/B, OE . . . . . . . . . . . . . . . . . . . . . . D
GND
≤ V
IN
≤ DV
CC
Output Short Circuit Operation . . . . . . . . . . . . . . . Indefinite
Storage Temperature Range . . . . . . . . . . . . –65ºC to +150ºC
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300ºC
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the Theory of
Operation section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2
Specification is for device in free air (T
A
= 25ºC).
3
24-lead TSSOP; T
JA
= 85ºC/W. Maximum internal power dissipation (PD) should be
derated for ambient temperature (T
A
) such that PD < (150ºC T
A
)/T
JA
.
4
T
JA
of 85⬚C/W is on a 4-layer board (2s 2p).
MAXIMUM POWER DISSIPATION
The maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150ºC. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a
junction temperature of 175ºC for an extended period can result
in device failure.
While the AD8186/AD8187 is internally short circuit protected,
this may not be sufficient to guarantee that the maximum junction
temperature (150ºC) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves shown in Figure 2.
PIN CONFIGURATION
IN0A
D
GND
V
REF
OUT 0
OUT 1
OUT 2
IN1A
IN2A
IN2B
IN1B
IN0B
V
CC
V
EE
V
EE
V
EE
V
CC
OE
SEL A/B
V
EE
V
CC
V
CC
V
CC
V
EE
DV
CC
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
AD8186/
AD8187
TOP VIEW
(Not to Scale)
AMBIENT TEMPERATURE (C)
–50 –40
MAXIMUM POWER DISSIPATION (W)
1.0
0.5
1.5
0
2.0
2.5
–30 –20 –10 0 10 20 30 40 50 60 70 80 90
Figure 2. Maximum Power Dissipation vs. Temperature
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD8186ARU –40ºC to +85ºC 24-Lead Thin Shrink Small Outline Package (TSSOP) RU-24
AD8186ARU-REEL –40ºC to +85ºC 13" Reel TSSOP RU-24
AD8186ARU-REEL 7
–40ºC to +85ºC 7" Reel TSSOP RU-24
AD8187ARU –40ºC to +85ºC 24-Lead Thin Shrink Small Outline Package (TSSOP) RU-24
AD8187ARU-REEL –40ºC to +85ºC 13" Reel TSSOP RU-24
AD8187ARU-REEL 7
–40ºC to +85ºC 7" Reel TSSOP RU-24
AD8186-EVAL Evaluation Board
AD8187-EVAL Evaluation Board
