MCP1650/51/52/53
DS21876B-page 22 2004-2013 Microchip Technology Inc.
7.0 PACKAGING INFORMATION
7.1 Package Marking Information
8-Lead MSOP (MCP1650, MCP1651, MCP1652)
Example:
XXXXX
YWWNNN
1650SE
0448256
10-Lead MSOP (MCP1653)
Example:
XXXXX
YYWWNNN
1653SE
0448256
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
2004-2013 Microchip Technology Inc. DS21876B-page 23
MCP1650/51/52/53
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
D
A
A1
L
c
(F)
α
A2
E1
E
p
B
n 1
2
φ
β
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
.037 REFFFootprint (Reference)
exceed .010" (0.254mm) per side.
Notes:
Drawing No. C04-111
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
β
α
c
B
φ
.003
.009
.006
.012
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016 .024
.118 BSC
.118 BSC
.000
.030
.193 TYP.
.033
MIN
p
n
Units
.026 BSC
NOM
8
INCHES
0.95 REF
-
-
.009
.016
0.08
0.22
0.23
0.40
MILLIMETERS*
0.65 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.031
.037
.006
0.40
0.00
0.75
MIN
MAX NOM
1.10
0.80
0.15
0.95
MAX
8
--
-
15° -
15° -
JEDEC Equivalent: MO-187
-
-
-
15°
15°
--
-
-
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
MCP1650/51/52/53
DS21876B-page 24 2004-2013 Microchip Technology Inc.
10-Lead Plastic Micro Small Outline Package (UN) (MSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging

MCP1650S-E/MS

Mfr. #:
Manufacturer:
Microchip Technology
Description:
Switching Controllers UVLO 2.55V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union