Sheet No.: D2-A05101EN
7
Fig.7 Output Current vs. Output Voltage Fig.8 Relative Current Transfer Ratio vs.
Ambient Temperature
Fig.5 Forward Current vs. Forward Voltage Fig.6 Relative Current Transfer Ratio vs.
Forward Current
PC457L0NIP Series
Forward voltage V
F
(V)
Forward current I
F
(mA)
1.0 1.2 1.4 1.6 1.8 2.0
1
10
100
0.1
T
a
=70˚C
T
a
=50˚C
T
a
=25˚C
T
a
=0˚C
T
a
=−25˚C
T
a
=−55˚C
Forward current I
F
(mA)
Relative current transfer ratio (%)
0.1 1 10 100
100
150
200
0
V
CC
=4.5V
V
O
=0.4V
T
a
=25˚C
50
CTR=100% at I
F
=16mA
Output current I
O
(mA)
8
10
12
14
16
18
0
Dotted line shows
pulse characteristics
4
6
I
F
=25mA
I
F
=20mA
I
F
=15mA
I
F
=10mA
I
F
=5mA
Output voltage V
O
(V)
024681012 2014 16 18
T
a
=25˚C
V
CC
=5V
2
Relative current transfer ratio (%)
90
100
110
120
130
140
150
50
60
Ambient temperature T
a
(˚C)
55 40 20 0 20 40 60 10080
I
F
=16mA
V
CC
=4.5V
V
O
=0.4V
70
80
CTR=100% at T
a
=25˚C
Fig.9 High Level Output Current vs.
Ambient Temperature
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Fig.10 Propagation Delay Time vs.
Ambient Temperature
Ambient temperature T
a
(˚C)
High level output current I
OH
(nA)
25
0255075100
1
10
100
1 000
0.1
I
F
=0
V
CC
=V
O
=30V
V
CC
=V
O
=15V
V
CC
=V
O
=5.5V
55 40 20 0 20 40 60 10080
Propagation delay time t
PHL
, t
PLH
(ns)
0
800
400
600
Ambient temperature T
a
(˚C)
t
PLH
t
PHL
200
I
F
=16mA
V
CC
=5V
R
L
=1.9k
Sheet No.: D2-A05101EN
8
Design Considerations
Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute de-
sign.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
Notes about static electricity
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01µF or more between V
CC
and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is floating capacitance may be generated and result in
false operation since current may go through LED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of LED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent LED.
Design guide
Degradation
In general, the emission of the LED used in photocouplers will degrade over time.
In the case of long term operation, please take the general LED degradation (50% degradation over 5years)
into the design consideration.
PC457L0NIP Series
Parameter
Input current
Supply voltage
Fan out (TTL load)
MIN. TYP.
5
MAX.
16
5
Unit
mA
V
Symbol
I
F
V
CC
N
Operating temperature +70
7
CT
opr
Recommended Foot Print (reference)
(Unit : mm)
0.8
1.5
6.3
1.271.27
Recommended operating conditions
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A05101EN
Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
9
1234
300
200
100
0
0
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC457L0NIP Series

PC457L0YIP

Mfr. #:
Manufacturer:
Sharp Microelectronics
Description:
OPTOISO 3.75KV TRANSISTOR 6-SMD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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