NCP1216, NCP1216A
www.onsemi.com
16
ORDERING INFORMATION
Device Version Marking Package Shipping
NCP1216D65R2G 65 kHz 16D06 SOIC8
(PbFree)
2500 / Tape & Reel
NCP1216D100R2G 100 kHz 16D10 SOIC8
(PbFree)
2500 / Tape & Reel
NCP1216D133R2G 133 kHz 16D13 SOIC8
(PbFree)
2500 / Tape & Reel
NCP1216P65G 65 kHz P1216P065 PDIP7
(PbFree)
50 Units / Rail
NCP1216P100G 100 kHz P1216P100 PDIP7
(PbFree)
50 Units / Rail
NCP1216P133G 133 kHz P1216P133 PDIP7
(PbFree)
50 Units/ Rail
NCP1216AD65R2G 65 kHz 16A06 SOIC8
(PbFree)
2500 / Tape & Reel
NCP1216AD100R2G 100 kHz 16A10 SOIC8
(PbFree)
2500 / Tape & Reel
NCP1216AD133R2G 133 kHz 16A13 SOIC8
(PbFree)
2500 / Tape & Reel
NCP1216AP65G 65 kHz 1216AP06 PDIP7
(PbFree)
50 Units / Rail
NCP1216AP100G 100 kHz P1216AP10 PDIP7
(PbFree)
50 Units / Rail
NCP1216AP133G 133 kHz P1216AP13 PDIP7
(PbFree)
50 Units / Rail
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCP1216, NCP1216A
www.onsemi.com
17
PACKAGE DIMENSIONS
SOIC8 NB
CASE 75107
ISSUE AK
SEATING
PLANE
1
4
58
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0 8 0 8
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
X
Y
G
M
Y
M
0.25 (0.010)
Z
Y
M
0.25 (0.010) Z
S
X
S
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒ
mm
inches
Ǔ
SCALE 6:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NCP1216, NCP1216A
www.onsemi.com
18
PACKAGE DIMENSIONS
PDIP7 (PDIP8 LESS PIN 7)
P SUFFIX
CASE 626B
ISSUE C
14
58
b2
NOTE 8
D
b
L
A1
A
eB
E
A
TOP VIEW
C
SEATING
PLANE
0.010 CA
SIDE VIEW
END VIEW
END VIEW
WITH LEADS CONSTRAINED
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
E1
M
8X
c
D1
B
H
NOTE 5
e
e/2
A2
NOTE 3
M
B
M
NOTE 6
M
DIM MIN MAX
INCHES
A −−−− 0.210
A1 0.015 −−−−
b 0.014 0.022
C 0.008 0.014
D 0.355 0.400
D1 0.005 −−−−
e 0.100 BSC
E 0.300 0.325
M −−−− 10
−−− 5.33
0.38 −−−
0.35 0.56
0.20 0.36
9.02 10.16
0.13 −−−
2.54 BSC
7.62 8.26
−−− 10
MIN MAX
MILLIMETERS
E1 0.240 0.280 6.10 7.11
b2
eB −−−− 0.430 −−− 10.92
0.060 TYP 1.52 TYP
A2 0.115 0.195 2.92 4.95
L 0.115 0.150 2.92 3.81
°°
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NCP1612/D
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Sales Representative

NCP1216AD100R2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Switching Controllers Current Mode PWM w/50% Duty Cycle Max
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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