ISD4002 SERIES
Publication Release Date: September 2003
- 5 - Revision 1
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2
2. FEATURES ......................................................................................................................................... 3
3. BLOCK DIAGRAM .............................................................................................................................. 4
4. TABLE OF CONTENTS ...................................................................................................................... 5
5. PIN CONFIGURATION ....................................................................................................................... 6
6. PIN DESCRIPTION............................................................................................................................. 7
7. FUNCTIONAL DESCRIPTION.......................................................................................................... 12
7.1. Detailed Description.................................................................................................................... 12
7.2. Serial Peripheral Interface (SPI) Description..............................................................................13
7.2.1. OPCODES ........................................................................................................................... 14
7.2.2. SPI Diagrams ....................................................................................................................... 15
7.2.3. SPI Control and Output Registers........................................................................................ 16
8. TIMING DIAGRAMS.......................................................................................................................... 18
9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 20
9.1. Operating Conditions .................................................................................................................. 21
10. ELECTRICAL CHARACTERISTICS ............................................................................................... 22
10.1. Parameters For Packaged Parts ........................................................................................ 22
10.2. Parameters For Die .............................................................................................................. 25
10.3. SPI AC Parameters .............................................................................................................. 26
11. TYPICAL APPLICATION CIRCUIT.................................................................................................27
12. PACKAGING AND DIE INFORMATION ......................................................................................... 30
12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 30
12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP)............................................................... 31
12.3. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1................................ 32
12.4. Die Information ......................................................................................................................... 33
13. ORDERING INFORMATION........................................................................................................... 35
14. VERSION HISTORY ....................................................................................................................... 36
