ESD5384
http://onsemi.com
2
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
PP
External pins (A1, A2, A3, B3 and C3):
ESD IEC 61000−4−2, level 4 – air discharge
ESD IEC 61000−4−2, level 4 – contact discharge
Internal pins (B1, C1):
ESD IEC 61000−4−2, level 1 – air discharge
ESD IEC 61000−4−2, level 1 – contact discharge
± 15
± 8
± 2
± 2
kV
T
op
Operating Temperature Range −30 to +85 °C
T
stg
Storage Temperature Range −55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (Note 1)
Symbol Test Condition Min Typ Max Unit
V
BR
Breakdown Voltage (I
r
= 1mA) 6 20 V
I
RM
Leakage Current @ V
rm
(V
rm
= 3 V per line), excluding HPD line 50 200 nA
I
RM
Leakage Current @ V
rm
(V
rm
= 3 V per line), HPD line 32
mA
R1, R2 Resistance 1575 1750 1925
W
R3 Pull−up Resistance 80 100 120
kW
R4 Pull−up Resistance 22 27 32
kW
C
line
V
line
= 0 V, V
osc
= 30 mV, F = 1 MHz, A2 with B1 not connected 14 17
pF
V
line
= 0 V, V
osc
= 30 mV, F = 1 MHz, A3, B3 with C1 not connected. 24 29
V
line
= 0 V, V
osc
= 30 mV, F = 1 MHz, A2, A3, B3 with C1 and B1 grounded 10 12
1. All parameters specified at T
A
= 25°C unless otherwise noted.
TYPICAL CHARACTERISTICS
Figure 2. Crosstalk Measurements
