ESD5384
http://onsemi.com
8
PACKAGE DIMENSIONS
WLCSP9, 1.14x1.14
CASE 567CX−01
ISSUE O
SEATING
PLANE
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
2X
DIM
A
MIN MAX
0.57
MILLIMETERS
A1
D 1.14 BSC
E
b 0.24 0.29
e 0.40 BSC
0.63
D
E
A
B
PIN A1
REFERENCE
A0.05 BC
0.03 C
0.05 C
9X
b
12 3
C
B
A
0.05 C
A
A1
A2
C
0.17 0.24
1.14 BSC
0.40
0.25
9X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.05 C
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
e
A2 0.41 REF
RECOMMENDED
A1
PACKAGE
OUTLINE
e
PITCH
0.40
PITCH
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