IXTH52P10P

© 2008 IXYS CORPORATION, All rights reserved
Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25°C to 150°C -100 V
V
DGR
T
J
= 25°C to 150°C, R
GS
= 1MΩ -100 V
V
GSS
Continuous ±20 V
V
GSM
Transient ±30 V
I
D25
T
C
= 25°C - 52 A
I
DM
T
C
= 25°C, pulse width limited by T
JM
-130 A
I
AR
T
C
= 25°C - 52 A
E
AS
T
C
= 25°C 1.5 J
dV/dt I
S
I
DM
, V
DD
V
DSS
, T
J
150°C 10 V/ns
P
D
T
C
= 25°C 300 W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
T
L
1.6mm (0.062 in.) from case for 10s 300 °C
T
SOLD
Plastic body for 10s 260 °C
M
d
Mounting torque (TO-3P,TO-220,TO-247) 1.13/10 Nm/lb.in.
Weight TO-247 6.0 g
TO-3P 5.5 g
TO-220 3.0 g
TO-263 2.5 g
DS99912A(5/08)
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified) Min. Typ. Max.
BV
DSS
V
GS
= 0V, I
D
= - 250μA -100 V
V
GS(th)
V
DS
= V
GS
, I
D
= - 250μA - 2.5 - 4.5 V
I
GSS
V
GS
= ± 20V, V
DS
= 0V ±100 nA
I
DSS
V
DS
= V
DSS
-10 μA
V
GS
= 0V T
J
= 125°C -150 μA
R
DS(on)
V
GS
= -10V, I
D
= 0.5 • I
D25
, Note 1 50 mΩ
PolarP
TM
Power MOSFET
P-Channel Enhancement Mode
Avalanche Rated
IXTA52P10P
IXTH52P10P
IXTP52P10P
IXTQ52P10P
V
DSS
= - 100V
I
D25
= - 52A
R
DS(on)
50m
ΩΩ
ΩΩ
Ω
Features:
z
International standard packages
z
Fast intrinsic diode
z
Dynamic dV/dt Rated
z
Avalanche Rated
z
Rugged PolarP
TM
process
z
Low Q
G
and R
ds(on)
characterization
z
Low Drain-to-Tab capacitance
z
Low package inductance
- easy to drive and to protect
Applications:
z
Hight side switching
z
Push-pull amplifiers
z
DC Choppers
z
Current regulators
z
Automatic test equipment
Advantages:
z
Low gate charge results in simple
drive requirement
z
Improved Gate, Avalanche and
dynamic dV/dt ruggedness
z
High power density
z
Fast switching
z
Easy to parallel
G = Gate D = Drain
S = Source TAB = Drain
TO-263 (IXTA)
G
S
D (TAB)
TO-247 (IXTH) TO-220 (IXTP)
D
G
S
G
D
S
TO-3P (IXTQ)
G
D
S
D (TAB) D (TAB)
D (TAB)
IXYS reserves the right to change limits, test conditions, and dimensions.
IXTA52P10P IXTH52P10P
IXTP52P10P IXTQ52P10P
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
Note 1: Pulse test, t 300μs; duty cycle, d 2%.
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified) Min. Typ. Max.
g
fs
V
DS
= -10V, I
D
= 0.5 • I
D25
, Note 1 12 20 S
C
iss
2845 pF
C
oss
V
GS
= 0V, V
DS
= - 25V, f = 1MHz 1015 pF
C
rss
275 pF
t
d(on)
22 ns
t
r
29 ns
t
d(off)
38 ns
t
f
22 ns
Q
g(on)
60 nC
Q
gs
V
GS
= -10V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 • I
D25
17 nC
Q
gd
23 nC
R
thJC
0.42 °C/W
R
thCS
(TO-3P)(TO-247) 0.21 °C/W
(TO-220) 0.50 °C/W
Source-Drain Diode
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, unless otherwise specified) Min. Typ. Max.
I
S
V
GS
= 0V - 52 A
I
SM
Repetitive, pulse width limited by T
JM
- 200 A
V
SD
I
F
= - 26A, V
GS
= 0V, Note 1 - 3.5 V
t
rr
120 ns
Q
RM
0.53 μC
I
RM
- 8.9 A
Resistive Switching Times
V
GS
= -10V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 • I
D25
R
G
= 3.3Ω (External)
I
F
= - 26A, -di/dt = -100A/μs
V
R
= - 50V, V
GS
= 0V
© 2008 IXYS CORPORATION, All rights reserved
IXTA52P10P IXTH52P10P
IXTP52P10P IXTQ52P10P
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.7 5.3 .185 .209
A
1
2.2 2.54 .087 .102
A
2
2.2 2.6 .059 .098
b 1.0 1.4 .040 .055
b
1
1.65 2.13 .065 .084
b
2
2.87 3.12 .113 .123
C .4 .8 .016 .031
D 20.80 21.46 .819 .845
E 15.75 16.26 .610 .640
e 5.20 5.72 0.205 0.225
L 19.81 20.32 .780 .800
L1 4.50 .177
P 3.55 3.65 .140 .144
Q 5.89 6.40 0.232 0.252
R 4.32 5.49 .170 .216
TO-247 (IXTH) Outline
Terminals: 1 - Gate 2 - Drain
e
P
1 2 3
TO-3P (IXTQ) Outline
Pins: 1 - Gate 2 - Drain
TO-220 (IXTP) Outline
TO-263 (IXTA) Outline

IXTH52P10P

Mfr. #:
Manufacturer:
Littelfuse
Description:
MOSFET -52.0 Amps -100V 0.050 Rds
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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