EFC3C001NUZ
www.onsemi.com
6
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WLCSP4 1.26x1.26 / EFCP1313-4DG-020
CASE 567LM
ISSUE O
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
DIM
A
MIN MAX
0.18
MILLIMETERS
b 0.22 0.28
e 0.50 BSC
0.22
D
E
A
B
PIN 1
REFERENCE
e
0.03 C
4X
b
0.03 C
A
C
0.25
4X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.50
0.50
TOP VIEW
SIDE VIEW
BOTTOM VIEW
e
RECOMMENDED
PACKAGE
OUTLINE
43
PITCH
PITCH
12
D 1.21
E 1.21 1.31
1.31
A1
A
M
0.10 BC
PACKAGE DIMENSIONS
unit : mm
ORDERING INFORMATION
Device Marking Package Shipping (Qty / Packing)
EFC3C001NUZTCG WC
WLCSP4, 1.26
1.26 /
EFCP1313-4DG-020
(Pb-Free / Halogen Free)
5,000 / Tape & Reel
† For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D. http://www.onsemi.com/pub_link/Collateral/BRD8011-D.PDF
Note on usage : Since the EFC3C001NUZ is a MOSFET product, please avoid using this device in the vicinity
of highly charged objects. Please contact sales for use except the designated application.
1 : Source1
2 : Gate1
3 : Gate2
4 : Source2
