BFU760F All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 29 April 2011 3 of 12
NXP Semiconductors
BFU760F
NPN wideband silicon germanium RF transistor
4. Marking
5. Limiting values
[1] T
sp
is the temperature at the solder point of the emitter lead.
6. Thermal characteristics
Table 4. Marking
Type number Marking Description
BFU760F D7* * = p : made in Hong Kong
* = t : made in Malaysia
* = w : made in China
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
collector-base voltage open emitter - 10 V
V
CEO
collector-emitter voltage open base - 2.8 V
V
EBO
emitter-base voltage open collector - 1.0 V
I
C
collector current - 70 mA
P
tot
total power dissipation T
sp
≤ 90 °C
[1]
- 220 mW
T
stg
storage temperature −65 +150 °C
T
j
junction temperature - 150 °C
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
R
th(j-sp)
thermal resistance from junction to solder point 270 K/W
Fig 1. Power derating curve
T
sp
(°C)
0 16012040 80
100
150
50
200
250
P
tot
(mW)
0