LTC4415
16
4415fa
Figure 10. Parallel Diodes with Current Limit Foldback and Reverse Polarity Protection
output falls below a threshold set by the resistor divider
on EN1 pin. This arrangement results in current limit
foldback, reducing the current limit of the parallel diodes
to that of only diode 2 when the output voltage falls, thus
controlling power dissipation.
An optional Schottky diode can be inserted in series with
the chip ground as shown in Figure 10 to protect LTC4415
against input power source reverse polarity. The presence
of the Schottky shifts the UVLO and enable pin thresholds
by a voltage equal to the forward voltage drop of the
Schottky diode.
Power Backup Using Supercapacitors and Optional
Keep-Alive Cell
An application of dual backup power is shown on the last
page of this data sheet. Diode 2 provides power to the
triple DC/DC converter (LTC3521) when the primary input
power (V
DD
) is available, possibly from a wall adapter. When
the input power falls below the supercapacitor voltage,
the supercapcitor provides power to the LTC3521. The
supercapacitor charger (LTC3625) provides a power failure
comparator output signal (PFO) when its input voltage
falls below a preset voltage defined by the resistive divider
on the PFI input. The PFO signal is available to start the
shutdown of high current applications. When the super-
capacitor discharges to a voltage level determined by the
resistor divider on EN1 input of LTC4415, the wired-AND
status signal of LTC4415 pulls up because neither of the
diode paths in LTC4415 are conducting and the coin cell
provides power through a back-to-back connected pair
of NFETs, M1 and M2. The wired-AND status signal is
available to signal that only low current circuits such as
real-time clock or memory remain enabled while operating
from the coin cell.
Figure 9. Microcontrolled PowerPath Monitoring and Control
Typical applicaTions
IDEAL
IDEAL
LTC4415
GND
EN1
MN1
IRLML2402
470k
4415 F09
4.7µF
LOAD
CLIM1
CLIM2
STAT1
WARN1
WARN2
STAT2
EN2
IN2
IN1 OUT1
OUT2
PRIMARY
POWER
SOURCE
AUXILLIARY
POWER
SOURCE
MICRO-
CONTROLLER
IDEAL
IDEAL
LTC4415
GND
EN1
470k
4415 F10
LOAD
CLIM1
CLIM2
STAT1
WARN1
WARN2
STAT2
EN2
IN2
D1
1N5817
IN1 OUT1
OUT2
POWER
SOURCE
ENABLE
LTC4415
17
4415fa
3.00 ±0.10
(2 SIDES)
5.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ±0.10
1.29 REF
BOTTOM VIEW—EXPOSED PAD
1.65 ±0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
R = 0.20
TYP
4.40 ±0.10
(2 SIDES)
18
169
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DHC16 Var A) DFN 0410
0.25 ±0.05
PIN 1
NOTCH
0.50 BSC
4.40 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.20 ±0.05
0.50 BSC
0.65 ±0.05
1.29 ±0.05
3.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
DHC Package
16-Lead Plastic DFN (5mm × 3mm)
(Reference LTC DWG # 05-08-1872 Rev Ø)
Variation A
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
LTC4415
18
4415fa
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MSOP (MSE16) 0911 REV E
0.53 ±0.152
(.021 ±.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
16
16151413121110
1 2 3 4 5 6 7 8
9
9
1
8
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL
NOT EXCEED 0.254mm (.010") PER SIDE.
0.254
(.010)
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ±0.127
(.035 ±.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ±0.038
(.0120 ±.0015)
TYP
0.50
(.0197)
BSC
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 ±0.102
(.112 ±.004)
2.845 ±0.102
(.112 ±.004)
4.039 ±0.102
(.159 ±.004)
(NOTE 3)
1.651 ±0.102
(.065 ±.004)
1.651 ±0.102
(.065 ±.004)
0.1016 ±0.0508
(.004 ±.002)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
0.280 ±0.076
(.011 ±.003)
REF
4.90 ±0.152
(.193 ±.006)
DETAIL “B”
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.12 REF
0.35
REF
MSE Package
16-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1667 Rev E)

LTC4415IDHC#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Power Management Specialized - PMIC 2x 4A Ideal Diodes w/ Adj C Lim
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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