RT7277
13
DS7277-01 March 2013 www.richtek.com
©
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Figure 7. PCB Layout Guide
Layout Consideration
Follow the PCB layout guidelines for optimal performance
of the RT7277
` Keep the traces of the main current paths as short and
wide as possible.
` Put the input capacitor as close as possible to the device
pins (VIN and GND).
EN
FB
PVCC
SS
VIN
BOOT
GND
SW
GND
2
3
4
5
6
7
8
9
C2
C1
C6
L1
V
OUT
C7
V
OUT
C4
C5
R1
R2
GND
Input capacitor must be placed
as close to the IC as possible.
SW should be connected to inductor by
wide and short trace. Keep sensitive
components away from this trace.
The resistor divider must be connected
as close to the device as possible.
` SW node is with high frequency voltage swing and
should be kept at small area. Keep sensitive
components away from the SW node to prevent stray
capacitive noise pickup.
` Connect feedback network behind the output capacitors.
Keep the loop area small. Place the feedback
components near the RT7277 feedback pin.
` The GND and Exposed Pad should be connected to a
strong ground plane for heat sinking and noise protection.
RT7277
14
DS7277-01 March 2013www.richtek.com
Richtek Technology Corporation
5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
A
B
J
F
H
M
C
D
I
Y
X
EXPOSED THERMAL PAD
(Bottom of Package)
8-Lead SOP (Exposed Pad) Plastic Package
Dimensions In Millimeters Dimensions In Inches
Symbol
Min Max Min Max
A 4.801 5.004 0.189 0.197
B 3.810 4.000 0.150 0.157
C 1.346 1.753 0.053 0.069
D 0.330 0.510 0.013 0.020
F 1.194 1.346 0.047 0.053
H 0.170 0.254 0.007 0.010
I 0.000 0.152 0.000 0.006
J 5.791 6.200 0.228 0.244
M 0.406 1.270 0.016 0.050
X 2.000 2.300 0.079 0.091
Option 1
Y 2.000 2.300 0.079 0.091
X 2.100 2.500 0.083 0.098
Option 2
Y 3.000 3.500 0.118 0.138
Outline Dimension

RT7277GSP

Mfr. #:
Manufacturer:
Description:
IC REG BUCK ADJUSTABLE 3A 8SOP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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