16 AT88SC6416C
5015KS–SMEM–08/09
15. Packaging Information
Ordering Code: MJ or MJTG
Module Size: M2
Dimension*: 12.6 x 11.4 [mm]
Glob Top: Round - 8.5 [mm]
Thickness: 0.58 [mm]
Pitch: 14.25 mm
*Note: The module dimensions listed refer to the dimensions of the exposed metal contact area. The actual
dimensions of the module after excise or punching from the carrier tape are generally 0.4 mm greater in both
directions (i.e., a punched M2 module will yield 13.0 x 11.8 mm).
AT88SC6416C
17
5015KS–SMEM–08/09
15.1. Ordering Code: SU
8S1 – JEDEC SOIC
Note:
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A1 0.10 0.25
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions,
tolerances, datums, etc.
A 1.35 1.75
b 0.31 0.51
C 0.17 0.25
D 4.80 5.05
E1 3.81 3.99
E 5.79 6.20
e1.27 BSC
L 0.40 1.27
0˚ –8˚
Top View
End View
Side View
e
D
A
A1
N
E
1
C
E1
L
DRAWING NO.
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
REV.
8S1 C
3/17/05
TITLE
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
b
18 AT88SC6416C
5015KS–SMEM–08/09
15.2. Ordering Code: PU
8P3 – PDIP
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
DRAWING NO.
2325 Orchard Parkway
San Jose, CA 95131
R
REV.
8P3 B
01/09/02
TITLE
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
A
A2
b
b2
b3
c
D
D1
E
E1
e
eA
L
0.115
0.014
0.045
0.030
0.008
0.355
0.005
0.300
0.240
0.115
0.130
0.018
0.060
0.039
0.010
0.365
0.310
0.250
0.130
0.210
0.195
0.022
0.070
0.045
0.014
0.400
0.325
0.280
0.150
2
5
6
6
3
3
4
3
4
2
0.100 BSC
0.300 BSC
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional
information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not
exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed
0.010 (0.25 mm).

AT88SC6416C-MJ

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
Security ICs / Authentication ICs CRYPTO Memory 64Kbit, 16zones
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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