LTC3601
22
3601fc
For more information www.linear.com/LTC3601
8.4V Input to 3.3V Output at 2MHz Operating
Frequency Using Forced Continuous Mode
Efficiency vs Load Current
V
IN
RUN
PGOOD
TRACK
LTC3601
PGNDSGND
INTV
CC
ITH
RT
MODE/SYNC
BOOST
SW
V
ON
FB
0.1µF
C
OUT
47µF
V
OUT
3.3V
1.5A
R1
90.9k
C
FF
10pF
R2
20k
3601 TA03a
L1
2.2µH
C2
2.2µF
C1
47µF
V
IN
8.4V
C
IN
: TDK C3225X5R1C476M
C
OUT
: TDK C3216X5R0J476M
L1: VISHAY IHLP2020BZER2R2M01
LOAD CURRENT (A)
0.01
40
EFFICIENCY (%)
50
60
70
80
0.1 1 10
3601 TA03b
30
20
10
0
90
100
TYPICAL APPLICATIONS
LTC3601
23
3601fc
For more information www.linear.com/LTC3601
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
3.00 ± 0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.45 ± 0.05
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.45 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.25 ± 0.05
1
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
15 16
2
0.50 BSC
0.200 REF
2.10 ± 0.05
3.50 ± 0.05
0.70 ±0.05
0.00 – 0.05
(UD16) QFN 0904
0.25 ±0.05
0.50 BSC
PACKAGE
OUTLINE
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
LTC3601
24
3601fc
For more information www.linear.com/LTC3601
MSOP (MSE16) 0213 REV F
0.53 ±0.152
(.021 ±.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
16
16151413121110
1 2 3 4 5 6 7 8
9
9
1
8
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
6. EXPOSED PAD DIMENSION DOES INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL
NOT EXCEED 0.254mm (.010") PER SIDE.
0.254
(.010)
0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.10
(.201)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ±0.127
(.035 ±.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ±0.038
(.0120 ±.0015)
TYP
0.50
(.0197)
BSC
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845 ±0.102
(.112 ±.004)
2.845 ±0.102
(.112 ±.004)
4.039 ±0.102
(.159 ±.004)
(NOTE 3)
1.651 ±0.102
(.065 ±.004)
1.651 ±0.102
(.065 ±.004)
0.1016 ±0.0508
(.004 ±.002)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
0.280 ±0.076
(.011 ±.003)
REF
4.90 ±0.152
(.193 ±.006)
DETAIL “B”
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.12 REF
0.35
REF
MSE Package
16-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1667 Rev F)
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

LTC3601IUD#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 1.5A, 15V, 4MHz Monolithic Synchronous Step-Down Regulator in 3x3 QFN
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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