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LQP03TQ1N2B02D

P1-P3P4-P6P7-P9P10-P12
Spec No. JELF243C-0024-01 P.10/12
MURATA MFG.CO., LTD
Reference Only
12.6 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to
warping the board.
［Products direction］
Products shall be located in the sideways
direction (Length:ａ＜b) to the mechanical
stress.
(2) Products location on P.C.B. separation
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A＞C＞B ≅ D.
12.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning Please contact us.
12.8 Resin coating
When products are coated with resin, please contact us in advance.
12.9 Handling of a substrate
(1)There is a possibility of chip cracking caused by PCBexpansion/contraction with heat, because stress
on a chip is different depending on PCB material and structure.
When the thermal expansion coefficient greatly differs between the board used for mounting and the chip,
it will cause cracking of the chip due to the thermal expansion and contraction.
The chip is assumed to be mounted on the PCB of glass-epoxy material, and we don't test with other
PCB material which has different thermal expansion coefficient from Glass-epoxy.
When other PCB materials are considered, please be sure to evaluate by yourself.
〈
Poor example
〉
〈
Good example
〉
b
a
Seam
Slit
A
D
B
C
b
a
Length:a
<
b
Spec No. JELF243C-0024-01 P.11/12
MURATA MFG.CO., LTD
Reference Only
(2)After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
In case of the mounting on flexible PCB, there is a possibility of chip cracking caused by mechanical stress
even from small bending or twisting.
When the flexible PCB is considered, please be sure to evaluate by yourself.
Bending Twisting
12.10 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after deliverd.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C ~ 40°C
Humidity ： 30% to 70% relative humidity No rapid change on temperature and humidity.
・Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and
so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
13．! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
Spec No. JELF243C-0024-01 P.12/12
MURATA MFG.CO., LTD
Reference Only
(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.
V
1
A B V
2
I
1
C D I
2
(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.
V
1
V
2
I
1
， I
2
(3) Thus,the relation between Zx and Zm is following;
Zm-β where, α= D / A =1
1-ZmΓ
β= B / D =Zsm-(1-Yom Zsm)Zss
Γ= C / A =Yom
Zsm:measured impedance of short chip
Zss:residual impedance of short chip (0.480nH)
Yom:measured admittance when opening the fixture
(4) Lx and Qx shall be calculated with the following equation.
Im(Zx) Im(Zx)
Lx :Inductance of chip coil
2πf ， Re(Zx) Qx:Q of chip coil
f :Measuring frequency
=
Zm=
Zx=
Zx= α
Lx=
Qx=
<Electrical Performance:Measuring Method of Inductance/Q>
A
B
C
D
Zm
Zx
V
1
2
1
2
ProductTest fixtureTest Head
I
I
V
P1-P3P4-P6P7-P9P10-P12

LQP03TQ1N2B02D

Mfr. #:
Buy LQP03TQ1N2B02D
Manufacturer:
Murata Electronics
Description:
Fixed Inductors 0201 1.2nH 800mA Rdc0.08ohm SRF17GHz
Lifecycle:
New from this manufacturer.
Delivery:
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