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LQP03TQ1N2B02D

P1-P3P4-P6P7-P9P10-P12
Spec No. JELF243C-0024-01 P.7/12
MURATA MFG.CO., LTD
Reference Only
10.2 Specification of Taping
(1) Packing quantity (standard quantity)
15,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc. , whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
10.3 Pull Strength
Cover tape 5N min
10.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force
0.1N to 0.6N
(minimum value is typical)
10.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
(in mm)
10.6 Marking for reel
Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2),
Quantity etc ･･･
∗1) <Expression of Inspection No.>
□□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D
Third, Fourth digit : Day
(3) Serial No.
∗2) <Expression of RoHS Marking > ROHS – Y (△)
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
Empty tape
190 min.
Leader
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180
φ
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Cover tape
+1
-0
Label
F
Cover tape
Base tape
165
°
to 180
゜
Spec No. JELF243C-0024-01 P.8/12
MURATA MFG.CO., LTD
Reference Only
10.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (∗2), Quantity, etc ･･･
10.8 Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93
5
∗ Above Outer Case size is typical. It depends on a quantity of an order.
11. ！ Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
12. Application notes
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
12.1 Land pattern designing
a 0.3
b 0.9
c 0.25
(in mm)
12.2 Flux, Solder
・ Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
・ Use Sn-3.0Ag-0.5Cu solder.
・ Standard thickness of solder paste : 100μm.
W
D
Label
H
ａ
ｂ
Chip Coil
Solder resist
Land
c
Spec No. JELF243C-0024-01 P.9/12
MURATA MFG.CO., LTD
Reference Only
12.3 Reflow soldering conditions
・ Pre-heating should be in such a way that the temperature difference between solder and
product surface is limited to 150°C max. Cooling into solvent after soldering also should be
in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of
products quality.
・ Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
・Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C～180°C 、90s±30s
Heating above 220°C､30s～60s above 230°C､60s max.
Peak temperature 245°C±3°C 260°C,10s
Cycle of reflow 2 times 2 times
12.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1,-0)s
Time 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the
crack on the products due to the thermal shock.
12.5 Solder Volume
･ Solder shall be used not to be exceeded the upper limits as shown below.
1/3T≦t≦2T
T : thickness of product
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance and become easy to tilt.
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245℃±3℃
220℃
30s～60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Upper Limit
Recommendable
P1-P3P4-P6P7-P9P10-P12

LQP03TQ1N2B02D

Mfr. #:
Buy LQP03TQ1N2B02D
Manufacturer:
Murata Electronics
Description:
Fixed Inductors 0201 1.2nH 800mA Rdc0.08ohm SRF17GHz
Lifecycle:
New from this manufacturer.
Delivery:
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