Philips Semiconductors Product data sheet
PCA9513; PCA9514Hot swappable I
2
C and SMBus bus buffer
2004 Oct 05
10
C1
0.01 µF
R4
10 k
R5
10 k
I/O PERIPHERAL CARD 1
R6
10 k
ENABLE
V
CC
SDAIN
SCLIN
SDAOUT
SCLOUT
ACC
GND
CARD_SDA
CARD_SCL
R1
10 k
R2
10 k
V
CC
SDA
SCL
BACKPLANE
BACKPLANE
CONNECTOR
C2 0.01 µF
C3
0.01 µF
R8
10 k
R9
10 k
I/O PERIPHERAL CARD 2
R10
10 k
ENABLE
V
CC
SDAIN
SCLIN
SDAOUT
SCLOUT
ACC
GND
CARD2_SDA
CARD2_SCL
C4 0.01 µF
SW02121
STAGGERED CONNECTOR
STAGGERED CONNECTOR
Figure 11. Hot swapping multiple I/O cards into a backplane using the PCA9514 in a PCI system
R3
1 k
R2
1 k
C2
0.01 µF
R5
10 k
ENABLE
V
CC
SDAOUT
SDAIN
READY
SCLOUT
SCLIN
GND
R4
10 k
R1
10 k
SCL
SDA
V
CC
SCL2
SDA2
R
DROP
V
CC_LOW
SW02123
Figure 12. System with disparate V
CC
voltages
Philips Semiconductors Product data sheet
PCA9513; PCA9514Hot swappable I
2
C and SMBus bus buffer
2004 Oct 05
11
ABSOLUTE MAXIMUM RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134).
Voltages with respect to pin GND.
LIMITS
SYMBOL PARAMETER MIN. MAX. UNIT
V
CC
Supply voltage range V
CC
–0.5 +7 V
V
n
SDAIN, SCLIN, SDAOUT, SCLOUT, READY, ENABLE –0.5 +7 V
I
I
Maximum current for inputs ±20 mA
I
IO
Maximum current for I/O pins ±50 mA
T
opr
Operating temperature range –40 +85 °C
T
stg
Storage temperature range –65 +125 °C
T
sld
Lead soldering temperature (10 sec max) +300 °C
T
j(max)
Maximum junction temperature +125 °C
NOTE:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
Philips Semiconductors Product data sheet
PCA9513; PCA9514Hot swappable I
2
C and SMBus bus buffer
2004 Oct 05
12
ELECTRICAL CHARACTERISTICS
V
CC
= 2.7 V to 5.5 V; T
amb
= –40 to +85 °C unless otherwise noted.
SYMBOL
PARAMETER
TEST CONDITIONS
LIMITS
UNIT
SYMBOL
PARAMETER
TEST
CONDITIONS
MIN. TYP. MAX.
UNIT
Power supply
V
CC
Supply voltage Note 1 2.7 5.5 V
I
CC
Supply current V
CC
= 5.5 V;
V
SDAIN
= V
SCLIN
= 0 V; Note 1
2.8 6 mA
I
CC(sd)
Supply current in shut-down mode V
ENABLE
= 0 V, all other pins at
V
CC
or GND
200 µA
Start-up circuitry
V
EN
Enable threshold voltage 0.5 × V
CC
0.7 × V
CC
V
V
DIS
Disable threshold voltage 0.3 × V
CC
0.5 × V
CC
V
I
EN
Enable input current Enable from 0 V to V
CC
± 0.1 ± 1 µA
t
EN
Enable delay or initialization time 130 µs
t
IDLE
Bus idle time Note 1 50 140 250 µs
t
DIS
Disable time, ENABLE to Ready 15 ns
t
STOP
SDAIN to READY delay after STOP Note 7 1.3 µs
t
READY
SCLOUT/SDAOUT to READY Note 7 1.2 µs
I
OFF
Ready off state leakage current V
EN
= V
CC
± 0.3 µA
C
i
ENABLE capacitance V
I
= V
CC
or GND; Note 4 2 pF
C
O
Ready capacitance V
I
= V
CC
or GND; Note 4 2 pF
V
OL(READY)
LOW-level output voltage on
READY pin
I
pull-up
= 3 mA; V
EN
= V
CC;
Note 1.
0.4 V
Rise time accelerators
I
PULLUPAC
Transient boosted pull-up current Positive transition on SDA, SCL,
V
CC
= 2.7 V;
Slew rate = 1.25 V/µs; Note 2
1 2 mA
Input–output connection
V
OS
Input–output offset voltage 10 k to V
CC
on SDA, SCL;
V
CC
= 3.3 V; Note 1; Note 3.
0 65 150 mV
f
SCL_SDA
operating frequency 0 400 kHz
t
PLH
SCL to SCL and SDA to SDA 10 k to V
CC
;
C
L
= 100 pF each side
20 ns
t
PHL
SCL to SCL and SDA to SDA 10 k to V
CC
;
C
L
= 100 pF each side
380 ns
C
IN
Digital input capacitance Note 4 10 pF
V
OL
LOW-level output voltage Input = 0 V;
SDA, SCL pins, I
SINK
= 3 mA;
V
CC
= 2.7 V; Note 1
0 0.4 V
I
PULLUP
SDAIN/SCLIN pull-up current V
ENABLE
=
V
CC;
Note 6 65 100 125 µA
I
LI
Input leakage current SDA, SCL pins = V
CC
= 5.5 V ±5 µA

PCA9513D,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC BUFFER I2C/SMBUS HOTSWAP 8SO
Lifecycle:
New from this manufacturer.
Delivery:
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