IRG4RC10SDTRRP

IRG4RC10SDPbF
07/04/07
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
Features
E
G
n-channel
C
V
CES
= 600V
V
CE(on) typ.
= 1.10V
@V
GE
= 15V, I
C
= 2.0A
Standard Speed CoPack
IGBT
• Extremely low voltage drop 1.1V(typ) @ 2A
• S-Series: Minimizes power dissipation at up to 3
KHz PWM frequency in inverter drives, up to 4
KHz in brushless DC drives.
• Tight parameter distribution
• IGBT co-packaged with HEXFRED
TM
ultrafast,
ultra-soft-recovery anti-parallel diodes for use
in bridge configurations
• Industry standard TO-252AA package
Benefits
• Generation 4 IGBT's offer highest efficiencies
available
• IGBT's optimized for specific application conditions
• HEXFRED diodes optimized for performance with
IGBT's . Minimized recovery characteristics require
less/no snubbing
• Lower losses than MOSFET's conduction and
Diode losses
D-PAK
TO-252AA
Parameter Max. Units
V
CES
Collector-to-Emitter Voltage 600 V
I
C
@ T
C
= 25°C Continuous Collector Current 14
I
C
@ T
C
= 100°C Continuous Collector Current 8.0
I
CM
Pulsed Collector Current 18 A
I
LM
Clamped Inductive Load Current 18
I
F
@ T
C
= 100°C Diode Continuous Forward Current 4.0
I
FM
Diode Maximum Forward Current 16
V
GE
Gate-to-Emitter Voltage ± 20 V
P
D
@ T
C
= 25°C Maximum Power Dissipation 38
P
D
@ T
C
= 100°C Maximum Power Dissipation 15
T
J
Operating Junction and -55 to +150
T
STG
Storage Temperature Range °C
W
Absolute Maximum Ratings
Thermal Resistance
°C/W
Parameter Typ. Max. Units
R
θJC
Junction-to-Case - IGBT ––– 3.3
R
θJC
Junction-to-Case - Diode ––– 7.0
R
θJA
Junction-to-Ambient (PCB mount)* –– 50
Wt Weight 0.3 (0.01) ––– g (oz)
* When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques refer to application note #AN-994
www.irf.com 1
• Lead-Free
PD - 95192A
IRG4RC10SDPbF
2 www.irf.com
Switching Characteristics @ T
J
= 25°C (unless otherwise specified)
Details of note through are on the last page
Parameter Min. Typ. Max. Units Conditions
V
(BR)CES
Collector-to-Emitter Breakdown Voltage 600 V V
GE
= 0V, I
C
= 250µA
V
(BR)CES
/T
J
Temperature Coeff. of Breakdown Voltage 0.64 V/°C V
GE
= 0V, I
C
= 1.0mA
V
CE(on)
Collector-to-Emitter Saturation Voltage 1.58 1.8 I
C
= 8.0A V
GE
= 15V
2.05 V I
C
= 14.0A See Fig. 2, 5
1.68 I
C
= 8.0A, T
J
= 150°C
V
GE(th)
Gate Threshold Voltage 3.0 6.0 V
CE
= V
GE
, I
C
= 250µA
V
GE(th)
/T
J
Temperature Coeff. of Threshold Voltage -9.5 mV/°C V
CE
= V
GE
, I
C
= 250µA
g
fe
Forward Transconductance 3.65 5.48 S V
CE
= 100V, I
C
=8.0A
I
CES
Zero Gate Voltage Collector Current 250 µA V
GE
= 0V, V
CE
= 600V
1000 V
GE
= 0V, V
CE
= 600V, T
J
= 150°C
V
FM
Diode Forward Voltage Drop 1.5 1.8 V I
C
=4.0A See Fig. 13
1.4 1.7 I
C
=4.0A, T
J
= 150°C
I
GES
Gate-to-Emitter Leakage Current ±100 nA V
GE
= ±20V
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Q
g
Total Gate Charge (turn-on) 15 22 I
C
= 8.0A
Qge Gate - Emitter Charge (turn-on) 2.42 3.6 nC V
CC
= 400V See Fig. 8
Q
gc
Gate - Collector Charge (turn-on) 6.53 9.8 V
GE
= 15V
t
d(on)
Turn-On Delay Time 76 T
J
= 25°C
t
r
Rise Time 32 ns I
C
= 8.0A, V
CC
= 480V
t
d(off)
Turn-Off Delay Time 815 1200 V
GE
= 15V, R
G
= 100
t
f
Fall Time 720 1080 Energy losses include "tail" and
E
on
Turn-On Switching Loss 0.31 diode reverse recovery.
E
off
Turn-Off Switching Loss 3.28 mJ See Fig. 9, 10, 18
E
ts
Total Switching Loss 3.60 10.9
E
ts
Total Switching Loss 1.46 2.6 mJ I
C
= 5.0A
t
d(on)
Turn-On Delay Time 70 T
J
= 150°C, See Fig. 10,11, 18
t
r
Rise Time 36 ns I
C
= 8.0A, V
CC
= 480V
t
d(off)
Turn-Off Delay Time 890 V
GE
= 15V, R
G
= 100
t
f
Fall Time 890 Energy losses include "tail" and
E
ts
Total Switching Loss 3.83 mJ diode reverse recovery.
L
E
Internal Emitter Inductance 7.5 nH Measured 5mm from package
C
ies
Input Capacitance 280 V
GE
= 0V
C
oes
Output Capacitance 30 pF V
CC
= 30V See Fig. 7
C
res
Reverse Transfer Capacitance 4.0 ƒ = 1.0MHz
t
rr
Diode Reverse Recovery Time 28 42 ns T
J
= 25°C See Fig.
—3857 T
J
= 125°C 14 I
F
=4.0A
I
rr
Diode Peak Reverse Recovery Current 2.9 5.2 A T
J
= 25°C See Fig.
3.7 6.7 T
J
= 125°C 15 V
R
= 200V
Q
rr
Diode Reverse Recovery Charge 40 60 nC T
J
= 25°C See Fig.
70 105 T
J
= 125°C 16 di/dt = 200A/µs
di
(rec)M
/dt Diode Peak Rate of Fall of Recovery 280 A/µs T
J
= 25°C See Fig.
During t
b
235 T
J
= 125°C 17
Parameter Min. Typ. Max. Units Conditions
IRG4RC10SDPbF
www.irf.com 3
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = I
RMS
of fundamental)
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
1
10
100
0.5 1.0 1.5 2.0 2.5 3.0
V , Collector-to-Emitter Voltage (V)
I , Collector Current (A)
CE
C
V = 15V
80µs PULSE WIDTH
GE
T = 25 C
J
°
T = 150 C
J
°
1
10
100
6 8 10 12
V , Gate-to-Emitter Voltage (V)
I , Collector-to-Emitter Current (A)
GE
C
V = 50V
s PULSE WIDTH
CC
T = 25 C
J
°
T = 150 C
J
°
5µs PULSE WIDTH
0.1 1 10 100
0.00
0.50
1.00
1.50
2.00
2.50
f, Frequency (KHz)
LOAD CURRENT (A)
60% of rated
voltage
I
Ideal diodes
Square wave:
For both:
Duty cycle: 50%
T = 125°C
T = 90°C
Gate drive as specified
sink
J
Power Dissipation = W
1.4
PCB Mount, Ta = 55°C

IRG4RC10SDTRRP

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
IGBT Transistors 600V DC-1 KHZ (STD) COPACK IGBT
Lifecycle:
New from this manufacturer.
Delivery:
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