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74LVT273D,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
74LVT273_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 10 September 2008 13 of 17
NXP Semiconductors
74LVT273
3.3 V octal D-type flip-flop
Fig 12. Package outline SOT360-1 (TSSOP20)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153
99-12-27
03-02-19
w M
b
p
D
Z
e
0.25
110
20
11
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
74LVT273_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 10 September 2008 14 of 17
NXP Semiconductors
74LVT273
3.3 V octal D-type flip-flop
Fig 13. Package outline SOT764-1 (DHVQFN20)
terminal 1
index area
0.51
A
1
E
h
b
UNIT
ye
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
4.6
4.4
D
h
3.15
2.85
y
1
2.6
2.4
1.15
0.85
e
1
3.5
0.30
0.18
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT764-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT764-1
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
20 terminals; body 2.5 x 4.5 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
29
19
12
11
10
1
20
X
D
E
C
B
A
terminal 1
index area
AC
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
02-10-17
03-01-27
74LVT273_3 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 03 — 10 September 2008 15 of 17
NXP Semiconductors
74LVT273
3.3 V octal D-type flip-flop
13. Abbreviations
14. Revision history
Table 10. Abbreviations
Acronym Description
BiCMOS Integrated Bipolar junction transistors and CMOS
CDM Charged Device Model
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
TTL Transistor-Transistor Logic
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74LVT273_3 20080910 Product data sheet - 74LVT273_2
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Title changed to 3.3 V octal D-type flip-flop
• Section 3 “Ordering information” and Section 12 “Package outline” DHVQFN20 package
added.
• Table 4 “Limiting values” T
j
and P
tot
values added.
74LVT273_2 19980219 Product specification - -
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

74LVT273D,118

Mfr. #:
Buy 74LVT273D,118
Manufacturer:
NXP Semiconductors
Description:
Flip Flops 3.3V OCTAL D
Lifecycle:
New from this manufacturer.
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