MAX1190
Dual 10-Bit, 120Msps, 3.3V, Low-Power ADC
with Internal Reference and Parallel Outputs
______________________________________________________________________________________ 13
Analog Inputs and Reference
Configurations
The full-scale range of the MAX1190 is determined by the
internally generated voltage difference between REFP
(V
DD
/ 2 + V
REFIN
/ 4) and REFN (V
DD
/ 2 - V
REFIN
/ 4).
The full-scale range for both on-chip ADCs is adjustable
through the REFIN pin, which is provided for this purpose.
The MAX1190 provides three modes of reference oper-
ation:
Internal reference mode
Buffered external reference mode
Unbuffered external reference mode
In internal reference mode, connect the internal refer-
ence output REFOUT to REFIN through a resistor (e.g.,
10kΩ) or resistor-divider, if an application requires a
reduced full-scale range. For stability and noise filtering
purposes, bypass REFIN with a > 10nF capacitor to
GND. In internal reference mode, REFOUT, COM,
REFP, and REFN become low-impedance outputs.
In buffered external reference mode, adjust the refer-
ence voltage levels externally by applying a stable and
accurate voltage at REFIN. In this mode, COM, REFP,
and REFN are outputs. REFOUT can be left open or
connected to REFIN through a > 10kΩ resistor.
In unbuffered external reference mode, connect REFIN to
GND. This deactivates the on-chip reference buffers for
REFP, COM, and REFN. With their buffers shut down,
these nodes become high-impedance inputs and can be
driven through separate, external reference sources.
For detailed circuit suggestions and how to drive this
dual ADC in buffered/unbuffered external reference
mode, see the Applications Information section.
Clock Input (CLK)
The MAX1190’s CLK input accepts a CMOS-compati-
ble clock signal. Since the interstage conversion of the
device depends on the repeatability of the rising and
falling edges of the external clock, use a clock with low
jitter and fast rise and fall times (< 2ns). In particular,
sampling occurs on the rising edge of the clock signal,
requiring this edge to provide the lowest possible jitter.
Any significant aperture jitter would limit the SNR per-
formance of the on-chip ADCs as follows:
where f
IN
represents the analog input frequency and t
AJ
is the time of the aperture jitter. Clock jitter is especially
critical for undersampling applications. The clock input
should always be considered as an analog input and
routed away from any analog input or other digital signal
lines. The MAX1190 clock input operates with a voltage
threshold set to V
DD
/ 2. Clock inputs with a duty cycle
other than 50%, must meet the specifications for high and
low periods as stated in the Electrical Characteristics.
SNR
ft
IN AJ
×× ×
20
1
2
log
π
N - 6
N
N - 5
N + 1
N - 4
N + 2
N - 3
N + 3
N - 2
N + 4
N - 1
N + 5
N
N + 6
N + 1
5-CLOCK-CYCLE LATENCY
ANALOG INPUT
CLOCK INPUT
DATA OUTPUT
D9A–D0A
t
DO
t
CH
t
CL
N - 6 N - 5 N - 4 N - 3 N - 2 N - 1 N N + 1
DATA OUTPUT
D9B–D0B
t
AD
Figure 3. System Timing Diagram
MAX1190
Dual 10-Bit, 120Msps, 3.3V, Low-Power ADC
with Internal Reference and Parallel Outputs
14 ______________________________________________________________________________________
System Timing Requirements
Figure 3 depicts the relationship between the clock
input, analog input, and data output. The MAX1190
samples at the rising edge of the input clock. Output
data for channels A and B is valid on the next rising
edge of the input clock. The output data has an internal
latency of five clock cycles. Figure 3 also determines
the relationship between the input clock parameters
and the valid output data on channels A and B.
Digital Output Data (D0A/B–D9A/B), Output
Data Format Selection (T/B), Output
Enable (
OE
)
All digital outputs, D0A–D9A (channel A) and D0B–D9B
(channel B), are TTL/CMOS-logic compatible. There is
a five-clock-cycle latency between any particular sam-
ple and its corresponding output data. The output cod-
ing can be chosen to be either straight offset binary or
two’s complement (Table 1) controlled by a single pin
(T/B). Pull T/B low to select offset binary and high to
activate two’s complement output coding. The capaci-
tive load on digital outputs D0A–D9A and D0B–D9B
should be kept as low as possible (< 15pF) to avoid
large digital currents that could feed back into the ana-
log portion of the MAX1190, thereby degrading its
dynamic performance. Using buffers on the digital out-
puts of the ADCs can further isolate the digital outputs
from heavy capacitive loads. To further improve the
dynamic performance of the MAX1190, small series
resistors (e.g., 100Ω) can be added to the digital output
paths, close to the MAX1190.
Figure 4 displays the timing relationship between out-
put enable and data output valid, as well as power-
down/wakeup and data output valid.
Power-Down (PD) and Sleep
(SLEEP) Modes
The MAX1190 offers two power-save modes—sleep
mode and full power-down mode. In sleep mode
(SLEEP = 1), only the reference bias circuit is active
(both ADCs are disabled), and current consumption is
reduced to 3mA.
To enter full power-down mode, pull PD high. With OE
simultaneously low, all outputs are latched at the last
value prior to the power down. Pulling OE high forces
the digital outputs into a high-impedance state.
Applications Information
Figure 5 depicts a typical application circuit containing
two single-ended to differential converters. The internal
reference provides a V
DD
/ 2 output voltage for level-
shifting purposes. The input is buffered and then split
to a voltage follower and inverter. One lowpass filter per
amplifier suppresses some of the wideband noise
associated with high-speed operational amplifiers. The
user can select the R
ISO
and C
IN
values to optimize the
filter performance to suit a particular application. For
the application in Figure 5, a R
ISO
of 50Ω is placed
before the capacitive load to prevent ringing and oscil-
lation. The 22pF C
IN
capacitor acts as a small filter
capacitor.
OUTPUT
D9A–D0A
OE
t
DISABLE
t
ENABLE
HIGH IMPEDANCEHIGH IMPEDANCE
VALID DATA
OUTPUT
D9B–D0B
HIGH IMPEDANCEHIGH IMPEDANCE
VALID DATA
Figure 4. Output Timing Diagram
DIFFERENTIAL INPUT
VOLTAGE*
DIFFERENTIAL INPUT
STRAIGHT OFFSET BINARY
T/B = 0
TWO’S COMPLEMENT
T/B = 1
V
REF
× 512/512 +FULL SCALE - 1 LSB 11 1111 1111 01 1111 1111
V
REF
× 1/512 +1 LSB 10 0000 0001 00 0000 0001
0 Bipolar Zero 10 0000 0000 00 0000 0000
-V
REF
× 1/512 -1 LSB 01 1111 1111 11 1111 1111
-V
REF
× 511/512 -FULL SCALE + 1 LSB 00 0000 0001 10 0000 0001
-V
REF
× 512/512 -FULL SCALE 00 0000 0000 10 0000 0000
Table 1. MAX1190 Output Codes For Differential Inputs
*V
REF
= V
REFP
- V
REFN
MAX1190
Dual 10-Bit, 120Msps, 3.3V, Low-Power ADC
with Internal Reference and Parallel Outputs
______________________________________________________________________________________ 15
INPUT
300Ω
-5V
+5V
0.1μF
0.1μF
0.1μF
-5V
600Ω
300Ω
INA-
INA+
LOWPASS FILTER
COM
600Ω
+5V
-5V
0.1μF
600Ω
300Ω
600Ω
300Ω
0.1μF
0.1μF
0.1μF
+5V
0.1μF
300Ω
MAX4108
MAX1190
INB-
INB+
MAX4108
MAX4108
LOWPASS FILTER
INPUT
300Ω
-5V
+5V
0.1μF
0.1μF
0.1μF
C
IN
22pF
-5V
600Ω
300Ω
LOWPASS FILTER
600Ω
+5V
-5V
0.1μF
600Ω
300Ω
600Ω
300Ω
0.1μF
0.1μF
0.1μF
+5V
0.1μF
300Ω
MAX4108
MAX4108
MAX4108
LOWPASS FILTER
R
IS0
50Ω
C
IN
22pF
R
IS0
50Ω
C
IN
22pF
R
IS0
50Ω
C
IN
22pF
R
IS0
50Ω
300Ω
300Ω
Figure 5. Typical Application for Single-Ended-to-Differential Conversion

MAX1190ECM+TD

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Analog to Digital Converters - ADC 10Bit 2Ch 120Msps 3.3V Low-Power ADC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet