YV09T60 60A DC-DC POL Converter
5V to 13.8V Input
• 0.6V to 1.98V Output
Data Sheet
ZD-01724 Rev 3.4, 07-Nov-10 www.power-one.com Page 1 of 14
Member of the Family
Applications
• Low voltage, high density systems with
Intermediate Bus Architectures (IBA)
• Point-of-load regulators for high performance
DSP, FPGA, ASIC, and microprocessors
• Desktops, servers, and portable computing
• Broadband, networking, optical, and
communications systems
Benefits
• One part that covers many applications
• Reduces board space, system cost and
complexity, and time to market
Features
• RoHS lead free and lead-solder-exempt products are
available
• High efficiency multiphase synchronous buck
topology
• Low noise fixed frequency operation
• Wide input voltage range: 5V–13.8V
• High continuous output current: 60A
• Programmable output voltage range: 0.6V–1.98V
• Overcurrent, output overvoltage, and overtemperature
protections with automatic restart
• Remote differential output voltage sense
• Power Good signal
• Enable input
• Start up into prebiased load
• No minimum load requirements
• High MTBF of 40.4MHrs
• Industry standard size through-hole single-in-line
package and pinout
• 2.58”x0.628” (65.5 x 16mm)
• Low height of 1.25” (31.8mm)
• Wide operating temperature range: 0 to 70ºC
• UL94 V-0 flammability rating
• UL60950, CSA C22.2 No. 60950-00, and TUV
EN60950-1:2001
Description
Power-One’s point-of-load converters are recommended for use with regulated bus converters in an Intermediate
Bus Architecture (IBA). The YV09T60 non-isolated DC-DC point of load (POL) converter delivers up to 60A of
output current, in an industry-standard single-in-line (SIP) through-hole package. The YV09T60 POL converter is
an ideal choice for Intermediate Bus Architectures where point of load conversion is a requirement. Operating
from a 5-13.8V input the POL converter provides an extremely tightly regulated programmable output voltage of
0.6V to 1.98V. The POL converters offer exceptional thermal performance, even in high temperature
environments with minimal airflow. This performance is accomplished through the use of advanced circuit
solutions, packaging and processing techniques. The resulting design possesses ultra-high efficiency, excellent
thermal management, and a slim body profile that minimizes impedance to system airflow, thus enhancing cooling
for both upstream and downstream devices. The use of automation for assembly, coupled with advanced power
electronics and thermal design, results in a product with extremely high reliability.
