LTC3569
22
3569fe
For more information www.linear.com/LTC3569
UD Package
20-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1720 Rev A)
package DescripTion
3.00 ± 0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65 ± 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
R = 0.05
TYP
0.20 ± 0.05
1
PIN 1 NOTCH
R = 0.20 TYP
OR 0.25 × 45°
CHAMFER
19 20
2
0.40 BSC
0.200 REF
2.10 ± 0.05
3.50 ± 0.05
(4 SIDES)
0.70 ±0.05
0.00 – 0.05
(UD20) QFN 0306 REV A
0.20 ±0.05
0.40 BSC
PACKAGE
OUTLINE
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
LTC3569
23
3569fe
For more information www.linear.com/LTC3569
package DescripTion
UDC Package
20-Lead Plastic QFN (3mm × 4mm)
(Reference LTC DWG # 05-08-1742 Rev Ø)
3.00 ± 0.10
1.50 REF
4.00 ± 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
19 20
1
2
BOTTOM VIEW—EXPOSED PAD
2.50 REF
0.75 ± 0.05
R = 0.115
TYP
PIN 1 NOTCH
R = 0.20 OR 0.25
× 45° CHAMFER
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UDC20) QFN 1106 REV Ø
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
0.25 ±0.05
2.50 REF
3.10 ± 0.05
4.50 ± 0.05
1.50 REF
2.10 ± 0.05
3.50 ± 0.05
PACKAGE OUTLINE
R = 0.05 TYP
1.65 ± 0.10
2.65 ± 0.10
1.65 ± 0.05
2.65 ± 0.05
0.50 BSC
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
LTC3569
24
3569fe
For more information www.linear.com/LTC3569
package DescripTion
FE16 (BA) TSSOP REV K 0913
0.09 – 0.20
(.0035 – .0079)
0° – 8°
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
1 3 4
5
6
7
8
10 9
4.90 – 5.10*
(.193 – .201)
16 1514 13 12 11
1.10
(.0433)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
2.74
(.108)
2.74
(.108)
0.195 – 0.30
(.0077 – .0118)
TYP
2
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
RECOMMENDED SOLDER PAD LAYOUT
3. DRAWING NOT TO SCALE
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
2.74
(.108)
2.74
(.108)
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
FE Package
16-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663 Rev K)
Exposed Pad Variation BA
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

LTC3569EFE#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Programmable 1.2A and 2X600mA, Triple Buck Regulator
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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