Electrical characteristics STPTIC
4/13 DocID023772 Rev 4
Table 4. Representative performances (T
amb
= 25 °C)
Symbol Parameter Conditions
Value
Unit
Min Typ Max
C
2V
Capacitance at 2V bias
STPTIC-12 1.08 1.20 1.32 pF
STPTIC-27 2.43 2.7 2.97 pF
STPTIC-33 2.97 3.3 3.63 pF
STPTIC-39 3.51 3.9 4.29 pF
STPTIC-47 4.23 4.7 5.17 pF
STPTIC-56 5.04 5.6 6.16 pF
STPTIC-68 6.12 6.8 7.48 pF
STPTIC-82 7.38 8.2 9.02
I
L
Leakage current Measured with V
bias
= 20 V 100 nA
ΔC Tuning range
Ratio between C
2V
/C
20V
measured at 100 kHz
3/1 3.5/1
Q
LB
Quality factor Measured at 900 MHz 65
Q
HB
Quality factor Measured at 1800 MHz 45
IP3 Third order intercept point
V
bias
= 2 V
(1)
and
(3)
1. F
1
= 894 MHz, F
2
= 849 MHz, P
1
= 20 dBm, P
2
= -15 dBm, 2f
1
- f
2
= 939 MHz
60 dBm
V
bias
= 20 V
(1)
and
(3)
70 dBm
H2 Second harmonic
V
bias
= 2 V
(2)
and
(3)
2. 894 MHz, P
in
= 34 dBm
-65 dBm
V
bias
= 20 V
(2)
and
(3)
-65 dBm
H3 Third harmonic
V
bias
= 2 V
(2)
and
(3)
-45 dBm
V
bias
= 20 V
(2)
and
(3)
3. IP3 and harmonics are measured in the shunt/series configuration in a 50 Ω environment
-45 dBm
t
T
Transition time
From C
min
to C
max
(4)
4. One or both of RF
in
and RF
out
must be connected to DC ground
135 µs
From C
max
to C
min
(4)
100 µs
DocID023772 Rev 4 5/13
STPTIC Package information
13
3 Package information
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 2. µQFN-6L package dimension
Figure 3. Recommended PCB land pattern for µQFN-6L package
C2
C1
C2
A2
B2
B1
C1
A1
27
1.2 mm 0.05 mm±
0.7 mm
0.425 mm
0.35 mm
± 0.03 mm
1.6 mm 0.05 mm±
0.9 mm
± 0.1 mm
0.25 mm
± 0.03 mm
0.5 mm
550 µm
600 µm
300 µm
Top Metal
NC
RF1
RF1
Bias
NC
RF2
Solder mask opening
RF1
RF2
RF1
250 µm
300 µm
200 µm
Package information STPTIC
6/13 DocID023772 Rev 4
Figure 4. Flip Chip dimensions (size for 1p5)
Figure 5. Flip Chip dimensions (size for 2p7, 3p3, 3p9, and 4p7)
Figure 6. Flip Chip dimensions (size for 5p6, 6p8, 8p2)
400 µm
190 µm 190 µm
440 µm
110 µm
110 µm
UBM pads
160 x 100 µm
300 ± 40 µm
780 ± 30 µm
660 ± 30 µm
200 ± 20 µm
500µm
360µm
140µm
440 µm
105 µm
105 µm
UBM pads
160 x 100 µm
290 ± 30 µm
1000 ± 30 µm
650 ± 30 µm
200 ± 20 µm
350 µm
350 µm
360 µm
140 µm
440 µm
105 µm
105 µm
UBM pads
160 x 100 µm
290 ± 30 µm
1200 ± 30 µm
650 ± 30 µm
200 ± 20 µm

STPTIC-68F1M6

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Trimmer / Variable Capacitors IPAD
Lifecycle:
New from this manufacturer.
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