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STPTIC-68F1M6

P1-P3P4-P6P7-P9P10-P12P13-P13
DocID023772 Rev 4 7/13
STPTIC Package information
13
Figure 7. Recommended PCB land pattern for Flip Chip package (metal defined pads,
solder mask 25 µm larger)
Figure 8. Recommended PCB land pattern for Flip Chip PTIC (die size 650 x 1200)
Solder mask
Metal defined pads
PTIC die size
650 X 1200 µm
250 x 230 µm
250 x 800 µm
Package information STPTIC
8/13 DocID023772 Rev 4
Figure 9. µQFN-6L tape and reel specification
Figure 10. Flip Chip tape and reel specification
Dot identifying b
ump A1 location
User direction of unreeling
Typical dimensions in mm
4.0
4.0
2.0
8.0
1.75
3.5
Ø 1.55
1.05
1.45
0.25
1.85
27
27
27
User direction of unreeling
Typical dimensions in mm
A0 = 1.12 mm for 2n7, 3p3, 3p9, and 4p7
A0 = 1.32 mm for 5p6, 6p8, and 8p2
4.0
2.0
A1 location
8.0
A0
2.0
1.75
3.5
Ø 1.55
0.36
0.76
0.25
DocID023772 Rev 4 9/13
STPTIC Package information
13
Figure 11. µQFN marking
Figure 12. Flip Chip marking (bump side view)
27
A
B
C
21
DIE
Die identifier
On bump side
P1-P3P4-P6P7-P9P10-P12P13-P13

STPTIC-68F1M6

Mfr. #:
Buy STPTIC-68F1M6
Manufacturer:
STMicroelectronics
Description:
Trimmer / Variable Capacitors IPAD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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