HMC903-Die Data Sheet
Rev. A | Page 4 of 13
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Drain Bias Voltage 4.5 V
RF Input Power
Gate Bias Voltages
V
GG
1 0.8 V to +0.2 V
V
GG
2 0.8 V to +0.2 V
Channel Temperature 175°C
Continuous Power Dissipation, P
DISS
(T =
85°C, Derate 6.9 mW/°C Above 8C)
0.62 W
Thermal Resistance (Channel to Die Bottom) 144.8°C/W
Storage Temperature Range 65°C to +150°C
Operating Temperature Range 55°C to +85°C
Electrostatic Discharge (ESD) Sensitivity,
Human Body Model (HBM)
Class 0, passed 150 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
Data Sheet HMC903-Die
Rev. A | Page 5 of 13
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
HMC903-Die
1RFIN
V
DD
1V
DD
2
RFOUT
V
GG
2V
GG
1
2
3
4
5
6
14481-002
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No. Mnemonic Description
1 RFIN Radio Frequency Input. This pad is matched to 50 Ω. See Figure 3 for the interface schematic.
2, 3 V
DD
1, V
DD
2
Power Supply Voltages. Power supply voltage for the amplifier. See Figure 24 and Figure 25 for required
external components. See Figure 4 for the interface schematic.
4 RFOUT Radio Frequency Output. This pad is matched to 50 Ω. See Figure 5 for the interface schematic.
5, 6 V
GG
2, V
GG
1
Gate Control Voltages. Optional gate control for amplifier. When left open, the amplifier is self biased.
Applying a negative voltage reduces the current. See Figure 6 for the interface schematic.
Die Bottom GND Ground. Die bottom must be connected to RF/dc ground. See Figure 7 for the interface schematic.
INTERFACE SCHEMATICS
RFIN
14481-003
ESD
Figure 3. RFIN Interface Schematic
V
DD
1, V
DD
2
14481-004
Figure 4. V
DD
1, V
DD
2 Interface Schematic
RFOUT
14481-005
ESD
Figure 5. RFOUT Interface Schematic
V
GG
1, V
GG
2
14481-006
Figure 6. V
GG
1, V
GG
2 Interface Schematic
GND
14481-007
Figure 7. GND Interface Schematic
HMC903-Die Data Sheet
Rev. A | Page 6 of 13
TYPICAL PERFORMANCE CHARACTERISTICS
25
15
–5
5
–15
–25
3
211917151311975
BROADBAND GAIN AND RETURN LOSS (dB)
FREQUENCY (GHz)
S11
S21
S22
14481-008
Figure 8. Broadband Gain and Return Loss vs. Frequency
0
–5
–10
–15
–20
–30
–25
6 18161412108
INPUT RETURN LOSS (dB)
FREQUENCY (GHz)
–55°C
+25°C
+85°C
14481-009
Figure 9. Input Return Loss vs. Frequency at Various Temperatures
6
4
5
3
2
1
0
6 18161412108
NOISE FIGURE (dB)
FREQUENCY (GHz)
–55°C
+25°C
+85°C
14481-010
Figure 10. Noise Figure vs. Frequency at Various Temperatures
25
23
19
21
17
15
6 8 10 12 14 16 18
GAIN (dB)
FREQUENCY (GHz)
–55°C
+25°C
+85°C
14481-011
Figure 11. Gain vs. Frequency at Various Temperature
0
–5
–10
–15
–20
–30
–25
6 18161412108
OUTPUT RETURN LOSS (dB)
FREQUENCY (GHz)
–40°C
+25°C
+85°C
14481-012
Figure 12. Output Return Loss vs. Frequency at Various Temperatures
35
25
30
20
15
10
5
6 18161412108
OUTPUT IP3 (dBm)
FREQUENCY (GHz)
–40°C
+25°C
+85°C
14481-013
Figure 13. Output IP3 vs. Frequency as Various Temperatures

HMC903-SX

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Amplifier LNA HIP3 6-18GHz
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet