MC14511BDR2G

MC14511B
http://onsemi.com
7
Figure 3. Logic Diagram
LE5
D6
C2
B1
A7
V
DD
= PIN 16
V
SS
= PIN 8
BI
4
LT3
14g
15f
9e
10d
11c
12b
13a
ORDERING INFORMATION
Device Package Shipping
MC14511BDG SOIC−16
(Pb−Free)
48 Units / Rail
MC14511BDR2G SOIC−16
(Pb−Free)
2500 / Tape & Reel
MC14511BDWR2G SO−16 WB
(Pb−Free)
1000 / Tape & Reel
NLV14511BDWR2G* SO−16 WB
(Pb−Free)
1000 / Tape & Reel
MC14511BFG SOEIAJ−16
(Pb−Free)
50 Units / Rail
MC14511BFELG SOEIAJ−16
(Pb−Free)
2000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
MC14511B
http://onsemi.com
8
PACKAGE DIMENSIONS
SOIC−16
PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
−B−
−A−
M
0.25 (0.010) B
S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
____
6.40
16X
0.58
16X
1.12
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT
16
89
8X
MC14511B
http://onsemi.com
9
PACKAGE DIMENSIONS
SOIC−16 WB
CASE 751G−03
ISSUE D
D
14X
B16X
SEATING
PLANE
S
A
M
0.25 B
S
T
16 9
81
h X 45
_
M
B
M
0.25
H8X
E
B
A
e
T
A1
A
L
C
q
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM MIN MAX
MILLIMETERS
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 10.15 10.45
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q 0 7
__
11.00
16X
0.58
16X
1.62
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT

MC14511BDR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Encoders, Decoders, Multiplexers & Demultiplexers LOG CMOS DSPLY DCODE DRVR
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union