SIA921EDJ-T1-GE3 Datasheet SIA921EDJ-T1-GE3, SIA921EDJ-T4-GE3 | P1-P3

Vishay Siliconix

SiA921EDJ

Document Number: 64734

S12-2731-Rev. C, 12-Nov-12

www.vishay.com

1

This document is subject to change without notice.

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

For technical questions, contact:: pmostechsupport@vishay.com

Dual P-Channel 20 V (D-S) MOSFET

FEATURES

• TrenchFET

®

Power MOSFET

• Thermally Enhanced PowerPAK

®

SC-70

Package

- Small Footprint Area

- Low On-Resistance

• Typical ESD Protection: 1700 V

• High Speed Switching

• Material categorization:

For definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

• Load Switch, PA Switch and Battery Switch for Portable

Devices

• DC/DC Converters

Notes:

a. Package limited.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See solder profile (www.vishay.com/doc?73257

). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed copper

(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not

required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 110 °C/W.

PRODUCT SUMMARY

V

DS

(V) R

DS(on)

()I

D

(A) Q

g

(Typ.)

- 20

0.059 at V

GS

= - 4.5 V

- 4.5

a

4.9 nC

0.098 at V

GS

= - 2.5 V

- 4.5

a

S

1

D

1

G

2

S

2

G

1

D

2

1

6

5

4

2

3

2.05 mm

PowerPAK SC-70-6 Dual

D

1

D

2

Ordering Information:

SiA921EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)

SiA921EDJ-T4-GE3 (Lead (Pb)-free and Halogen-free)

Marking Code

X X X

D F X

Lot Traceability

and Date code

Part # code

P-Channel MOSFET

S

2

D

2

G

2

P-Channel MOSFET

S

1

D

1

G

1

ABSOLUTE MAXIMUM RATINGS (T

A

= 25 °C, unless otherwise noted)

Parameter Symbol Limit Unit

Drain-Source Voltage

V

DS

- 20

V

Gate-Source Voltage

V

GS

± 12

Continuous Drain Current (T

J

= 150 °C)

T

C

= 25 °C

I

D

- 4.5

a

A

T

C

= 70 °C

- 4.5

a

T

A

= 25 °C

- 4.5

a, b, c

T

A

= 70 °C

- 3.7

b, c

Pulsed Drain Current

I

DM

- 15

Continuous Source-Drain Diode Current

T

C

= 25 °C

I

S

- 4.5

a

T

A

= 25 °C

- 1.6

b, c

Maximum Power Dissipation

T

C

= 25 °C

P

D

7.8

W

T

C

= 70 °C

5

T

A

= 25 °C

1.9

b, c

T

A

= 70 °C

1.2

b, c

Operating Junction and Storage Temperature Range

T

J

, T

stg

- 55 to 150

°C

Soldering Recommendations (Peak Temperature)

d, e

260

THERMAL RESISTANCE RATINGS

Parameter Symbol Typical Maximum Unit

Maximum Junction-to-Ambient

b, f

t  5 s

R

thJA

52 65

°C/W

Maximum Junction-to-Case (Drain) Steady State

R

thJC

12.5 16

www.vishay.com

2

Document Number: 64734

S12-2731-Rev. C, 12-Nov-12

Vishay Siliconix

SiA921EDJ

This document is subject to change without notice.

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

For technical questions, contact:: pmostechsupport@vishay.com

Notes:

a. Pulse test; pulse width  300 µs, duty cycle  2 %.

b. Guaranteed by design, not subject to production testing.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation

of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

SPECIFICATIONS (T

J

= 25 °C, unless otherwise noted)

Parameter Symbol Test Conditions Min. Typ. Max. Unit

Static

Drain-Source Breakdown Voltage

V

DS

V

GS

= 0 V, I

D

= - 250 µA

- 20 V

V

DS

Temperature Coefficient V

DS

/T

J

I

D

= - 250 µA

- 14

mV/°C

V

GS(th)

Temperature Coefficient V

GS(th)

/T

J

2.5

Gate-Source Threshold Voltage

V

GS(th)

V

DS

= V

GS

, I

D

= - 250 µA

- 0.5 - 1.4 V

Gate-Source Leakage

I

GSS

V

DS

= 0 V, V

GS

= ± 4.5 V

± 1

µA

V

DS

= 0 V, V

GS

= ± 12 V

± 10

Zero Gate Voltage Drain Current

I

DSS

V

DS

= - 20 V, V

GS

= 0 V

- 1

V

DS

= - 20 V, V

GS

= 0 V, T

J

= 55 °C

- 10

On-State Drain Current

a

I

D(on)

V

DS

- 5 V, V

GS

= - 4.5 V

- 15 A

Drain-Source On-State Resistance

a

R

DS(on)

V

GS

= - 4.5 V, I

D

= - 3.6 A

0.048 0.059



V

GS

= - 2.5 V, I

D

= - 1.5 A

0.080 0.098

Forward Transconductance

a

g

fs

V

DS

= - 10 V, I

D

= - 3.6 A

11 S

Dynamic

b

Total Gate Charge

Q

g

V

DS

= - 10 V, V

GS

= - 10 V, I

D

= - 4.7 A

15 23

nC

V

DS

= - 10 V, V

GS

= - 4.5 V, I

D

= - 4.7 A

7.1 11

Gate-Source Charge

Q

gs

1.3

Gate-Drain Charge

Q

gd

2.1

Gate Resistance

R

g

f = 1 MHz 6.3 

Tur n - O n D e l ay Time

t

d(on)

V

DD

= - 10 V, R

L

= 2.7 

I

D

 - 3.7 A, V

GEN

= - 4.5 V, R

g

= 1 

20 30

ns

Rise Time

t

r

20 30

Turn-Off Delay Time

t

d(off)

25 40

Fall Time

t

f

10 15

Tur n - O n D e l ay Time

t

d(on)

V

DD

= - 10 V, R

L

= 2.7 

I

D

 - 3.7 A, V

GEN

= - 10 V, R

g

= 1 

510

Rise Time

t

r

12 20

Turn-Off Delay Time

t

d(off)

25 40

Fall Time

t

f

10 15

Drain-Source Body Diode Characteristics

Continuous Source-Drain Diode Current

I

S

T

C

= 25 °C

- 4.5

A

Pulse Diode Forward Current

I

SM

- 15

Body Diode Voltage

V

SD

I

S

= - 3.7 A, V

GS

= 0 V

- 0.9 - 1.2 V

Body Diode Reverse Recovery Time

t

rr

I

F

= - 3.7 A, dI/dt = 100 A/µs, T

J

= 25 °C

15 30 ns

Body Diode Reverse Recovery Charge

Q

rr

612nC

Reverse Recovery Fall Time

t

a

8.5

ns

Reverse Recovery Rise Time

t

b

6.5

Vishay Siliconix

SiA921EDJ

Document Number: 64734

S12-2731-Rev. C, 12-Nov-12

www.vishay.com

3

This document is subject to change without notice.

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

For technical questions, contact:: pmostechsupport@vishay.com

TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)

Gate Current vs. Gate-to-Source Voltage

Output Characteristics

On-Resistance vs. Drain Current and Gate Voltage

V

GS

- Gate-to-Source Voltage (V)

I

G

- Gate Current (mA)

0.0

0.1

0.2

0.3

0.4

0.5

0369121518

I

GSS

at 25 °C (mA)

0

3

6

9

12

15

0.0 0.5 1.0 1.5 2.0 2.5 3.0

V

GS

=10V thru 3 V

V

GS

=1.5V

V

GS

=2.5V

V

GS

=2V

V

DS

- Drain-to-Source Voltage (V)

- Drain Current (A)I

D

0.00

0.05

0.10

0.15

0.20

0 3 6 9 12 15

V

GS

= 2.5 V

V

GS

=4.5V

- On-Resistance (Ω)R

DS(on)

I

D

- Drain Current (A)

Gate Current vs. Gate-to-Source Voltage

Transfer Characteristics

Capacitance

V

GS

- Gate-to-Source Voltage (V)

I

G

- Gate Current (A)

10

-10

10

-9

10

-8

10

-7

10

-6

10

-5

10

-4

10

-3

10

-2

0369121518

I

GSS

at 150 °C

I

GSS

at 25 °C

0

1

2

3

4

5

0.0 0.5 1.0 1.5 2.0

T

C

= 25 °C

T

C

= 125 °C

T

C

=- 55 °C

V

GS

- Gate-to-Source Voltage (V)

- Drain Current (A)I

D

C

rss

0

200

400

600

800

1000

048 12 16 20

C

iss

C

oss

V

DS

- Drain-to-Source Voltage (V)

C - Capacitance (pF)

SIA921EDJ-T1-GE3

SIA921EDJ-T1-GE3

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