15 of 28 June 18, 2014
IDT 89HPES6T5 Data Sheet
Power Consumption
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 13.
Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in
Table 13.
All power measurements assume that the part is mounted on a 10 layer printed circuit board with 0 LFM airflow.
Thermal Considerations
This section describes thermal considerations for the PES6T5 (15mm
2
BCG196 package). The data in Table 16 below contains information that is
relevant to the thermal performance of the PES6T5 switch.
Number of
Connected
Lanes
Core Supply
PCIe Digital
Supply
PCIe Analog
Supply
PCIe Termin-
ation Supply
I/O Supply Total
Typ
1.0V
Max
1.1V
Typ
1.0V
Max
1.1V
Typ
1.0V
Max
1.1V
Typ
1.5V
Max
1.575V
Typ
3.3V
Max
3.465V
Typ
Power
Max
Power
2/1/1/1/1 mA 330 416 305 339 144 154 140 150 3 3.3
Watts 0.33 0.46 0.31 0.37 0.14 0.17 0.21 0.24 0.01 0.01 1.00 1.25
Table 15 PES6T5 Power Consumption
Symbol Parameter Value Units Conditions
T
J(max)
Junction Temperature 125
o
CMaximum
T
A(max)
Ambient Temperature 70
o
C Maximum for commercial-rated products
T
A(max)
Ambient Temperature 85
o
C Maximum for industrial-rated products
JA(effective)
Effective Thermal Resistance, Junction-to-Ambient
33.3
o
C/W Zero air flow
29
o
C/W 1 m/S air flow
26.6
o
C/W 2 m/S air flow
JB
Thermal Resistance, Junction-to-Board 18.7
o
C/W
JC
Thermal Resistance, Junction-to-Case 9.8
o
C/W
P Power Dissipation of the Device 1.25 Watts Maximum
Table 16 Thermal Specifications for PES6T5, 15x15mm BCG196 Package
