*The reflow profile in Table 5 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are also compatible with the J-STD-020
profile.
t
P
t
L
t
25°C
TO PEAK TEMPERATURE
t
S
PREHEA
T
CRITICAL
ZONE
T
L
T
O T
P
TEMPER
ATURE
TIME
RAMP-DOWN
RAMP-U
P
T
SMIN
T
SMAX
T
P
T
L
ICS-52000
Page 8 of 20
Document Number: DS-000121
Revision: 1.3
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 3. Pin Configuration (Top View, Terminal Side Down)
TABLE 6. PIN FUNCTION DESCRIPTIONS
PIN NAMETYPEFUNCTION
1
WSO
Output
WS output, connect to WS of the next ICS-52000 in the daisy-chain.
2
CONFIG
Input
Pull to VDD. The state of this pin is used at power-up.
3
VDD
Power
Power, 1.62V to 3.63V. This pin should be decoupled to GND with a 0.1 μF capacitor.
4
GND
Ground
Ground.Connect to ground on the PCB.
5
WS
Input
Serial Data-Word Select for TDMInterface
6
SCK
Input
Serial Data Clock for TDMInterface
7
SD
Output
Serial Data Output for TDMInterface. This pin tri-states when not actively driving the appropriate
output channel. The SD trace should have a 100 kΩ pulldown resistor to discharge the line during
the time that all microphones on the bus have tri-stated their outputs.
WSO
CONFIG
VDD
GND
SD
SCK
WS
1
2
3
7
6
5
4
ICS-52000
Page 9 of 20
Document Number: DS-000121
Revision: 1.3
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 4. Typical Frequency Response (Measured)
Figure 5. Total Harmonic Distortion + Noise (THD+N) vs. Input SPL
Figure 6. PSR vs. Frequency, 100 mV p-p Swept Sine Wave
