DATA SHEET
Product specification
Supersedes data of 2000 Mar 29
2010 Sep 16
DISCRETE SEMICONDUCTORS
BF1202; BF1202R; BF1202WR
N-channel dual-gate PoLo
MOS-FETs
2010 Sep 16 2
NXP Semiconductors Product specification
N-channel dual-gate PoLo MOS-FETs BF1202; BF1202R; BF1202WR
FEATURES
Short channel transistor with high
forward transfer admittance to input
capacitance ratio
Low noise gain controlled amplifier
Partly internal self-biasing circuit to
ensure good cross-modulation
performance during AGC and good
DC stabilization.
APPLICATIONS
VHF and UHF applications with
3 to 9 V supply voltage, such as
digital and analogue television
tuners and professional
communications equipment.
DESCRIPTION
Enhancement type N-channel
field-effect transistor with source and
substrate interconnected. Integrated
diodes between gates and source
protect against excessive input
voltage surges. The BF1202,
BF1202R and BF1202WR are
encapsulated in the SOT143B,
SOT143R and SOT343R plastic
packages respectively.
PINNING
Marking code legend:
* = - : made in Hong Kong
* = p : made in Hong Kong
* = t : made in Malaysia
PIN DESCRIPTION
1source
2drain
3gate2
4gate1
handbook, 2 columns
Top view
MSB014
12
34
Fig.1 Simplified outline
(SOT143B).
BF1202 marking code: LD*
handbook, 2 columns
Top view MSB035
12
43
Fig.2 Simplified outline
(SOT143R).
BF1202R marking code: LE*
lfpage
Top view
MSB842
21
43
Fig.3 Simplified outline
(SOT343R).
BF1202WR marking code: LE*
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
DS
drain-source voltage 10 V
I
D
drain current 30 mA
P
tot
total power dissipation 200 mW
y
fs
forward transfer admittance 25 30 40 mS
C
ig1-ss
input capacitance at gate 1 1.7 2.2 pF
C
rss
reverse transfer capacitance f = 1 MHz 15 30 fF
F noise figure f = 800 MHz 1.1 1.8 dB
X
mod
cross-modulation input level for k = 1% at
40 dB AGC
100 105 dBV
T
j
operating junction temperature 150 C
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling.
2010 Sep 16 3
NXP Semiconductors Product specification
N-channel dual-gate PoLo MOS-FETs BF1202; BF1202R; BF1202WR
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. T
s
is the temperature of the soldering point of the source lead.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DS
drain-source voltage 10 V
I
D
drain current 30 mA
I
G1
gate 1 current 10 mA
I
G2
gate 2 current 10 mA
P
tot
total power dissipation
BF1202; BF1202R T
s
113 C; note 1 200 mW
BF1202WR T
s
119 C; note 1 200 mW
T
stg
storage temperature 65 +150 C
T
j
operating junction temperature 150 C
SYMBOL PARAMETER VALUE UNIT
R
th j-s
thermal resistance from junction to soldering point
BF1202; BF1202R 185 K/W
BF1202WR 155 K/W
handbook, halfpage
050
(1)
(2)
T
s
(°C)
P
tot
(mW)
100 200
250
0
200
150
150
100
50
MCD951
Fig.4 Power derating curve.
(1) BF1202WR.
(2) BF1202; BF1202R.

BF1202,215

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RF MOSFET Transistors Dual N-Channel 10V 30mA 200mW
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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