Electrical characteristics
STW40N65M2
4/12
DocID027443 Rev 1
2 Electrical characteristics
(T
C
= 25 °C unless otherwise specified)
Table 5: On/off states
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source breakdown
voltage
V
GS
= 0 V, I
D
= 1 mA 650
V
I
DSS
Zero gate voltage Drain
current
V
GS
= 0 V, V
DS
= 650 V
1 µA
V
GS
= 0 V, V
DS
= 650 V,
T
C
= 125 °C
100 µA
I
GSS
Gate-body leakage current
V
DS
= 0 V, V
GS
= ± 25 V
±10 µA
V
GS(th)
Gate threshold voltage V
DS
= V
GS
, I
D
= 250 µA 2 3 4 V
R
DS(on)
Static drain-source on-
resistance
V
GS
= 10 V, I
D
= 16 A
0.087 0.099 Ω
Table 6: Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
C
iss
Input capacitance
V
DS
= 100 V, f = 1 MHz,
V
GS
= 0 V
- 2355 - pF
C
oss
Output capacitance - 102 - pF
C
rss
Reverse transfer
capacitance
-
2.7
- pF
C
oss eq.
(1)
Equivalent output
capacitance
V
DS
= 0 V to 520 V, V
GS
= 0 V - 380 - pF
R
G
Intrinsic gate resistance f = 1 MHz open drain - 4.5 - Ω
Q
g
Total gate charge
V
DD
= 520 V, I
D
= 32 A,
V
GS
= 10 V (see Figure 15:
"Gate charge test circuit")
- 56.5 - nC
Q
gs
Gate-source charge -
8
- nC
Q
gd
Gate-drain charge - 24 - nC
Notes:
(1)
C
oss eq.
is defined as a constant equivalent capacitance giving the same charging time as C
oss
when V
DS
increases from 0 to 80% V
DSS
Table 7: Switching times
Symbol Parameter Test conditions Min. Typ. Max. Unit
t
d(on)
Turn-on delay time
V
DD
= 325 V, I
D
= 16 A
R
G
= 4.7 Ω, V
GS
= 10 V (see
Figure 14: "Switching times
test circuit for resistive load"
and Figure 19: "Switching time
waveform")
-
15
- ns
t
r
Rise time - 10 - ns
t
d(off)
Turn-off-delay time -
96.5
- ns
t
f
Fall time - 12 - ns
STW40N65M2
Electrical characteristics
DocID027443 Rev 1
5/12
Table 8: Source drain diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
SD
Source-drain
current
-
32 A
I
SDM
(1)
Source-drain
current
(pulsed)
-
128
A
V
SD
(2)
Forward on
voltage
V
GS
= 0 V, I
SD
= 32 A -
1.6 V
t
rr
Reverse
recovery time
I
SD
= 32 A, di/dt = 100 A/µs, V
DD
= 60 V
(see Figure 16: " Test circuit for inductive
load switching and diode recovery times")
- 468
ns
Q
rr
Reverse
recovery
charge
-
8.7
µC
I
RRM
Reverse
recovery
current
- 37.5
A
t
rr
Reverse
recovery time
I
SD
= 32 A, di/dt = 100 A/µs, V
DD
= 60 V,
T
j
= 150 °C (see Figure 16: " Test circuit
for inductive load switching and diode
recovery times")
- 610
ns
Q
rr
Reverse
recovery
charge
-
11.7
µC
I
RRM
Reverse
recovery
current
-
39
A
Notes:
(1)
Pulse width is limited by safe operating area
(2)
Pulse test: pulse duration = 300 µs, duty cycle 1.5%
Electrical characteristics
STW40N65M2
6/12
DocID027443 Rev 1
2.2 Electrical characteristics (curves)
Figure 2: Safe operating area
Figure 3: Thermal impedance
Figure 4: Output characteristics
Figure 5: Transfer characteristics
Figure 6: Normalized gate threshold voltage
vs temperature
Figure 7: Normalized V
(BR)DSS
vs temperature
I
D
10
1
0.1
0.1
1
100
10
(A)
100µs
1ms
10ms
100
10µs
Operation in this area is
limited by max R
DS(on)
V
DS
(V)
T
j
= 150 °C
T
c
= 25 °C
Single pulse
GIPD030220151540ALS
K
t
p
Ƭ
Z
th
= K*R
thj-c
δ= t
p
/Ƭ
Single pulse
0.01
δ=0.5
10
-1
10
-2
10
-3
10
-4
10
-5
10
-3
10
-2
10
-1
0.2
0.1
0.05
0.02
t
p
(s)
GC18460
DS
GIPG300120151500ALS
V
GS
= 6,7,8,9,10 V
V
70
60
50
40
30
20
10
0
0 4 8 12 16 20 24
I
D
(A)
V (V)
GS
= 5 V
V
GS
= 4 V
GIPG300120151715ALS
0 2 4 6 8
70
60
50
40
30
20
10
0
I
D
(A)
V
GS
(V)
V
GS
= 20 V

STW40N65M2

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
MOSFET N-channel 650 V, 0.087 Ohm typ., 32 A MDmesh M2 Power MOSFET in TO-220 package
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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