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ICS-43432

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
ICS-43432
PCB DESIGN AND LAND PATTERN LAYOUT
The recommended PCB land pattern for the ICS-43432 should be laid out to a 1:1 ratio to the solder pads on the microphone
package, as shown in Figure 15. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste
stencil pattern layout is shown in Figure 16. The diameter of the sound hole in the PCB should be larger than the diameter of the
sound port of the microphone. A minimum diameter of 0.5 mm is recommended.
Figure 15. PCB Land Pattern Layout
Dimensions shown in millimeters
Figure 16. Suggested Solder Paste Stencil Pattern Layout
Dimensions shown in millimeters
PCB MATERIAL AND THICKNESS
The performance of the ICS-43432 is not affected by PCB thickness. The ICS-43432 can be mounted on either a rigid or flexible PCB.
A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
6X 0.40X0.60
2.15
0.65 0.65 1.275
1.08
Ø
1.65
Ø
1.05
2.15
1.275
Ø
1.65
0.65
0.65
0.1(4x)
6X 0.30X0.50
Ø
1.15
Page 16 of 20
Document Number: DS-000038
Revision: 1.0
ICS-43432
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-and-place and chip shooting equipment. Take care to avoid damage to the
MEMS microphone structure as follows:
• Use a standard pickup tool to handle the microphone. Because the microphone hole is on the bottom of the package, the
pickup tool can make contact with any part of the lid surface.
• Do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone.
Do not pull air out of or blow air into the microphone port.
• Do not use excessive force to place the microphone on the PCB.
REFLOW SOLDER
For best results, the soldering profile must be in accordance with the recommendations of the manufacturer of the solder paste used to
attach the MEMS microphone to the PCB. It is recommended that the solder reflow profile not exceed the limit conditions specified
in Figure 2 and Table 5.
BOARD WASH
When washing the PCB, ensure that water does not make contact with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.
Page 17 of 20
Document Number: DS-000038
Revision: 1.0
ICS-43432
OUTLINE DIMENSIONS
Figure 17. 7-Terminal Chip Array Small Outline No Lead Cavity
4.00 × 3.00 × 1.00 mm Body
Dimensions shown in millimeters
Figure 18. Package Marking Specification (Top View)
ORDERING GUIDE
PART
TEMP RANGE
PACKAGE
QUANTITY
PACKAGING
ICS-43432
−40°C to +85°C
7-Terminal LGA_CAV
4,500
13” Tape and Reel
EV_ICS-43432-FX
Flex Evaluation Board
0.125±0.05
0.125±0.05
0.125±0.05
Ø1.65
Ø1.05
0.25
0.07
1.10
0.40X0.60 (6x)
1.075
BOTTOM VIEW
SIDE VIEWTOP VIEW
3.00±0.10
B
4.00±0.10
REFERENCE CORNER
d 0.10
A
(4X)
1.0±0.10
f 0.10 C
C
(0.266)
(0.72)
(2.80)
(3.86)
0.125±0.05
0.25
1.50
2.15
4.00
3.00
Ø0.35
j 0.10 m C A B
432
YYXXXX
PART
NUMBE
R
LOT TR ACEABILIT YDATE COD E
PIN 1 INDIC ATIO N
Page 18 of 20
Document Number: DS-000038
Revision: 1.0
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20

ICS-43432

Mfr. #:
Buy ICS-43432
Manufacturer:
TDK InvenSense
Description:
MIC MEMS DIGITAL I2S OMNI -26DB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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