NXP Semiconductors
PHPT60603NY
60V, 3 A NPN high power bipolar transistor
PHPT60603NY All information provided in this document is subject to legal disclaimers. © NXP N.V. 2014. All rights reserved
Product data sheet 10 January 2014 3 / 15
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CBO
collector-base voltage open emitter - 60 V
V
CEO
collector-emitter voltage open base - 60 V
V
EBO
emitter-base voltage open collector - 7 V
I
C
collector current - 3 A
I
CM
peak collector current single pulse; t
p
≤ 1 ms - 8 A
I
B
base current - 0.5 A
[1] - 1.25 W
[2] - 3 W
[3] - 5 W
P
tot
total power dissipation T
amb
≤ 25 °C
[4] - 25 W
T
j
junction temperature - 175 °C
T
amb
ambient temperature -55 175 °C
T
stg
storage temperature -65 175 °C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB); single-sided copper; tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB; single-sided copper; tin-plated and mounting pad for collector 6 cm
2
.
[3] Device mounted on an ceramic PCB; Al
2
O
3
, standard footprint.
[4] Power dissipation from junction to mounting base.
(1) Ceramic PCB, Al
2
O
3
, standard footprint
(2) FR4 PCB, mounting pad for collector 6 cm
2
(3) FR4 PCB, standard footprint
Fig. 1. Power derating curves
NXP Semiconductors
PHPT60603NY
60V, 3 A NPN high power bipolar transistor
PHPT60603NY All information provided in this document is subject to legal disclaimers. © NXP N.V. 2014. All rights reserved
Product data sheet 10 January 2014 4 / 15
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
[1] - - 115 K/W
[2] - - 50 K/W
R
th(j-a)
thermal resistance
from junction to
ambient
in free air
[3] - - 30 K/W
R
th(j-sp)
thermal resistance
from junction to solder
point
- - 6 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for collector 6 cm
2
.
[3] Device mounted on an ceramic Printed-Circuit Board (PCB), Al
2
O
3
, standard footprint.
aaa-010427
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
-1
10
-5
1010
-2
10
-4
10
2
10
-1
t
p
(s)
10
-3
10
3
1
duty cycle = 1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01
0
0.25
FR4 PCB, standard footprint
Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
NXP Semiconductors
PHPT60603NY
60V, 3 A NPN high power bipolar transistor
PHPT60603NY All information provided in this document is subject to legal disclaimers. © NXP N.V. 2014. All rights reserved
Product data sheet 10 January 2014 5 / 15
aaa-010428
10
-5
1010
-2
10
-4
10
2
10
-1
t
p
(s)
10
-3
10
3
1
10
1
10
2
Z
th(j-a)
(K/W)
10
-2
duty cycle = 1
0.75
0.5
0.33
0.25
0.2
0.1
0.05
0.02
0.01
0
FR4 PCB, mounting pad for collector 6 cm
2
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

PHPT60603NYX

Mfr. #:
Manufacturer:
Nexperia
Description:
Bipolar Transistors - BJT NPN High Power BipolarTransistor
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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