ADG1608/ADG1609 Data Sheet
Rev. A | Page 10 of 20
1
2
3
4
5
6
7
8
EN
V
SS
S1A
S4A
S3
A
S2A
A0
D
A
16
15
14
13
12
11
10
9
GND
V
DD
S1B
S4B
DB
S3B
S2B
A1
ADG1609
TOP VIEW
(Not to Scale)
08318-005
Figure 5. ADG1609 Pin Configuration (TSSOP)
08318-006
PIN 1
INDICATOR
1
V
SS
2S1A
3
S2
A
4
S3A
11 S1B
12 V
DD
10
S2B
9
S3B
5
S4
A
6
D
A
7
SB
8
S4B
15
A0
16
EN
14
A1
13
GND
T
OP VIEW
(Not to Scale)
ADG1609
NOTES
1. THE EXPOSED PAD IS CONNECTED
INTERNALLY. FOR INCREASED
RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL
CAPABILITY, IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE SUBSTRATE, V
SS
.
Figure 6. ADG1609 Pin Configuration (LFCSP)
Table 10. ADG1609 Pin Function Descriptions
Pin No.
TSSOP LFCSP Mnemonic Description
1 15 A0 Logic Control Input.
2 16 EN
Active High Digital Input. When this pin is low, the device is disabled and all switches are off. When this pin
is high, Ax logic inputs determine on switches.
3 1 V
SS
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground.
4 2 S1A Source Terminal 1A. Can be an input or an output.
5 3 S2A Source Terminal 2A. Can be an input or an output.
6 4 S3A Source Terminal 3A. Can be an input or an output.
7 5 S4A Source Terminal 4A. Can be an input or an output.
8 6 DA Drain Terminal A. Can be an input or an output.
Drain Terminal B. Can be an input or an output.
10 8 S4B Source Terminal 4B. Can be an input or an output.
11 9 S3B Source Terminal 3B. Can be an input or an output.
12 10 S2B Source Terminal 2B. Can be an input or an output.
13 11 S1B Source Terminal 1B. Can be an input or an output.
14 12 V
DD
Most Positive Power Supply Potential.
15 13 GND Ground (0 V) Reference.
16 14 A1 Logic Control Input.
N/A EP EP
Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and
maximum thermal capability, it is recommended that the pad be soldered to the substrate, V
SS
.
Table 11. ADG1609 Truth Table
A1 A0 EN On Switch Pair
X
1
X
1
0 None
0 1 1 2
1 0 1 3
1 1 1 4
1
X = don’t care.