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ADG1609BRUZ

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
Data Sheet ADG1608/ADG1609
Rev. A | Page 7 of 20
CONTINUOUS CURRENT PER CHANNEL, S OR D
Table 5. ADG1608
Parameter 25°C 85°C 125°C Unit
CONTINUOUS CURRENT, S OR D
V
DD
= +5 V, V
SS
= −5 V
TSSOP (θ
JA
= 112.6°C/W) 290 180 100 mA max
LFCSP (θ
JA
= 48.7°C/W) 470 255 120 mA max
V
DD
= 12 V, V
SS
= 0 V
TSSOP (θ
JA
= 112.6°C/W)
213
129
73
mA max
LFCSP (θ
JA
= 48.7°C/W) 346 185 84 mA max
V
DD
= 5 V, V
SS
= 0 V
TSSOP (θ
JA
= 112.6°C/W) 157 101 63 mA max
LFCSP (θ
JA
= 48.7°C/W) 252 150 77 mA max
V
DD
= 3.3 V, V
SS
= 0 V
TSSOP (θ
JA
= 112.6°C/W) 126 87 56 mA max
LFCSP (θ
JA
= 48.7°C/W) 206 129 73.5 mA max
Table 6. ADG1609
Parameter 25°C 85°C 125°C Unit
CONTINUOUS CURRENT, S OR D
V
DD
= +5 V, V
SS
= −5 V
TSSOP (θ
JA
= 112.6°C/W)
147
98
63
mA max
LFCSP (θ
JA
= 48.7°C/W) 245 147 77 mA max
V
DD
= 12 V, V
SS
= 0 V
TSSOP (θ
JA
= 112.6°C/W) 157 101 63 mA max
LFCSP (θ
JA
= 48.7°C/W) 255 150 77 mA max
V
DD
= 5 V, V
SS
= 0 V
TSSOP (θ
JA
= 112.6°C/W) 115 80 52 mA max
LFCSP (θ
JA
= 48.7°C/W) 189 119 70 mA max
V
DD
= 3.3 V, V
SS
= 0 V
TSSOP (θ
JA
= 112.6°C/W) 94 66 45 mA max
LFCSP (θ
JA
= 48.7°C/W) 154 101 63 mA max
ADG1608/ADG1609 Data Sheet
Rev. A | Page 8 of 20
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 7.
Parameter Rating
V
DD
to V
SS
18 V
V
DD
to GND −0.3 V to +18 V
V
SS
to GND +0.3 V to −18 V
Analog Inputs
1
V
SS
− 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Digital Inputs
1
GND − 0.3 V to V
DD
+ 0.3 V or
30 mA, whichever occurs first
Peak Current, S or D
710 mA (pulsed at 1 ms,
10% duty cycle maximum)
Continuous Current, S or D
2
Data + 15%
Operating Temperature Range
Industrial −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
16-Lead TSSOP, θ
JA
Thermal
Impedance, 0 Airflow
(4-Layer Board)
112.6°C/W
16-Lead LFCSP, θ
JA
Thermal
Impedance, 0 Airflow
(4-Layer Board)
48.7°C/W
Reflow Soldering Peak
Temperature, Pb-free
260°C
1
Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
2
See Table 5 and Table 6.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
Data Sheet ADG1608/ADG1609
Rev. A | Page 9 of 20
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
EN
V
SS
S1
S4
S3
S2
A0
D
16
15
14
13
12
1
1
10
9
A2
GND
V
DD
S7
S8
S6
S5
A1
ADG1608
T
O
P
VIEW
(Not to Scale)
08318-003
Figure 3. ADG1608 Pin Configuration (TSSOP)
08318-004
PIN 1
INDIC
A
T
OR
1
V
SS
2
S1
3
S2
4
S3
1
1
V
DD
12
GND
10
S5
9
S6
5
S4
6
D
7
S8
8
S7
15
A0
16
EN
14
A1
13
A2
T
O
P
VIEW
(Not to Scale)
ADG1608
NOTES
1. THE EXPOSED PAD IS CONNECTED
INTERNALLY. FOR INCREASED
RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL
CAPABILITY, IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE SUBSTRATE, V
SS
.
Figure 4. ADG1608 Pin Configuration (LFCSP)
Table 8. ADG1608 Pin Function Descriptions
Pin No.
TSSOP LFCSP Mnemonic Description
1 15 A0 Logic Control Input.
2 16 EN
Active High Digital Input. When this pin is low, the device is disabled and all switches are off. When this pin
is high, Ax logic inputs determine on switches.
3 1 V
SS
Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground.
4 2 S1 Source Terminal 1. Can be an input or an output.
5 3 S2 Source Terminal 2. Can be an input or an output.
6 4 S3 Source Terminal 3. Can be an input or an output.
7 5 S4 Source Terminal 4. Can be an input or an output.
8 6 D Drain Terminal. Can be an input or an output.
9 7 S8 Source Terminal 8. Can be an input or an output.
10 8 S7 Source Terminal 7. Can be an input or an output.
11
9
S6
Source Terminal 6. Can be an input or an output.
12 10 S5 Source Terminal 5. Can be an input or an output.
13 11 V
DD
Most Positive Power Supply Potential.
14 12 GND Ground (0 V) Reference.
15 13 A2 Logic Control Input.
16 14 A1 Logic Control Input.
N/A EP EP
Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and
maximum thermal capability, it is recommended that the pad be soldered to the substrate, V
SS
.
Table 9. ADG1608 Truth Table
A2 A1 A0 EN On Switch
X
1
X
1
X
1
0 None
0 0 0 1 1
0 0 1 1 2
0
1
0
1
3
0 1 1 1 4
1 0 0 1 5
1 0 1 1 6
1 1 0 1 7
1 1 1 1 8
1
X = don’t care.
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ADG1609BRUZ

Mfr. #:
Buy ADG1609BRUZ
Manufacturer:
Analog Devices Inc.
Description:
Multiplexer Switch ICs 4:1 71MHz 4.5 Ohm CMOS
Lifecycle:
New from this manufacturer.
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