7
Electrical/Optical Characteristics 0 to 70°C, unless otherwise stated.
Parameter Symbol Min. Typ.
[2]
Max. Unit Condition Note
Transmitter Output P
T
-9.5 -7.0 -4.8 dBm I
F,dc
= 20 mA, 25°C Note 3
Optical Power, 1 mm POF -10.4 -4.3 0-70°C
Transmitter Output P
T
-6.0 -3.0 -0.5 dBm I
F,dc
= 60 mA, 25°C Note 3
Optical Power, 1 mm POF -6.9 -0.0 0-70°C
Transmitter Output P
T
-14.6 -13.0 -10.5 dBm I
F,dc
= 60 mA, 25°C Note 3
Optical Power, -15.5 -10.0 0-70°C
200 μm HCS
®
Output Optical Power ΔP
T
-0.02 dB/°C
Temperature Coe cient ΔT
Peak Emission Wavelength
PK
640 650 660 nm
Peak Wavelength Δ 0.12 nm/°C
Temperature Coe cient ΔT
Spectral Width FWHM 21 nm Full Width,
Half Maximum
Forward Voltage V
F
1.8 2.1 2.4 V I
F
= 60 mA
Forward Voltage ΔV
F
-1.8 mV/°C
Temperature Coe cient ΔT
Transmitter Numerical NA 0.5
Aperture
Thermal Resistance,
jc
140 °C/W Note 4
Junction to Case
Reverse Input Breakdown V
BR
3.0 13 V I
F,dc
= -10 μA
Voltage
Diode Capacitance C
O
60 pF V
F
= 0 V,
f = 1 MHz
Unpeaked Optical Rise t
r
12 ns I
F
= 60 mA Figure 1
Time, 10% - 90% f = 100 kHz Note 5
Unpeaked Optical Fall t
f
9 ns I
F
= 60 mA Figure 1
Time, 90% - 10% f = 100 kHz Note 5
Notes:
1. 1.6 mm below seating plane.
2. Typical data is at 25°C.
3. Optical Power measured at the end of 0.5 meter of 1 mm diameter plastic or 200 μm diameter hard clad silica optical ber with a large area
detector.
4. Typical value measured from junction to PC board solder joint for horizontal mount package, HFBR-1527Z.
jc
is approximately
30°C/W higher for vertical mount package, HFBR-1537Z.
5. Optical rise and fall times can be reduced with the appropriate driver circuit; refer to Application Note 1066.
6. Pins 5 and 8 are primarily for mounting and retaining purposes, but are electrically connected; pins 3 and 4 are electrically unconnected. It is
recommended that pins 3, 4, 5, and 8 all be connected to ground to reduce coupling of electrical noise.
7. Refer to the Versatile Link Family Fiber Optic Cable and Connectors Technical Data Sheet for cable connector options for 1 mm plastic optical
ber and 200 μm HCS ber.
8. The LED current peaking necessary for high frequency circuit design contributes to electromagnetic interference (EMI). Care must be taken in
circuit board layout to minimize emissions for compliance with governmental EMI emissions regulations. Refer to Application Note 1066 for
design guidelines.
9. Moisture sensitivity level (MSL) is 3
