ADG714/ADG715
OUTLINE DIMENSIONS
Figu
re 1. 24-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-24)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADG714BRUZ −40°C to +85°C 24-Lead TSSOP RU-24
ADG714BRUZ-REEL −40°C to +85°C 24-Lead TSSOP RU-24
ADG714BRUZ-REEL7 −40°C to +85°C 24-Lead TSSOP RU-24
ADG715BRU −40°C to +85°C 24-Lead TSSOP RU-24
ADG715BRU-REEL7 −40°C to +85°C 24-Lead TSSOP RU-24
ADG715BRUZ −40°C to +85°C 24-Lead TSSOP RU-24
ADG715BRUZ-REEL −40°C to +85°C 24-Lead TSSOP RU-24
ADG715BRUZ-REEL7 −40°C to +85°C 24-Lead TSSOP RU-24
1
Z = RoHS Compliant Part.
REVISION HISTORY
10/15—Rev. C to Rev. D
Changes to ADG714 Timing Characteristics Table and
Figure 1 ............................................................................................... 5
Changes to Ordering Guide ........................................................... 16
1/13—Rev. B to Rev. C
Changes to Dual Supply Table Summary and I
DD
Test
Conditions/Comments ..................................................................... 4
Changes to Ordering Guide ........................................................... 16
11/02—Rev. A to Rev. B
Edits to Features ................................................................................ 1
Edits to General Description ........................................................... 1
Edits to Product Highlights ............................................................. 1
Edits to Specifications ................................................................... 3, 4
Edits to TPCs 2 and 5 ..................................................................... 10
Edits to TPCs 8 and 9 ..................................................................... 11
Edits to TPCs 14 .............................................................................. 12
Edits to Figure 8 .............................................................................. 15
4/00—Revision 0: Initial Version
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
24
13
121
6.40 BSC
4.50
4.40
4.30
PIN 1
7.90
7.80
7.70
0.15
0.05
0.30
0.19
0.65
BSC
1.20
MAX
0.20
0.09
0.75
0.60
0.45
8°
0°
SEATING
PLANE
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AD
©2000–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00043-0-10/15(D)
–
16–
REV.
D
