CY7C199D
Document Number: 38-05471 Rev. *L Page 7 of 15
Switching Characteristics
Over the operating range
Parameter
[7]
Description
CY7C199D-10
Unit
Min Max
Read Cycle
t
power
[8]
V
CC(typical)
to the first access 100 s
t
RC
Read cycle time 10 ns
t
AA
Address to data valid 10 ns
t
OHA
Data hold from address change 3 ns
t
ACE
CE LOW to data valid 10 ns
t
DOE
OE LOW to data valid 5 ns
t
LZOE
[9]
OE LOW to low Z 0 ns
t
HZOE
[9, 10]
OE HIGH to high Z 5 ns
t
LZCE
[9]
CE LOW to low Z 3 ns
t
HZCE
[9, 10]
CE HIGH to high Z 5 ns
t
PU
[11]
CE LOW to power-up 0 ns
t
PD
[11]
CE HIGH to power-down 10 ns
Write Cycle
[12, 13]
t
WC
Write cycle time 10 ns
t
SCE
CE LOW to write end 7 ns
t
AW
Address setup to write end 7 ns
t
HA
Address hold from write end 0 ns
t
SA
Address setup to write start 0 ns
t
PWE
WE pulse width 7 ns
t
SD
Data setup to write end 6 ns
t
HD
Data hold from write end 0 ns
t
HZWE
[9]
WE LOW to high Z 5 ns
t
LZWE
[9, 10]
WE HIGH to low Z 3 ns
Notes
7. Test conditions assume signal transition time of 3 ns or less for all speeds, timing reference levels of 1.5 V, input pulse levels of 0 to 3.0 V, and output loading of the
specified I
OL
/I
OH
and 30-pF load capacitance.
8. t
POWER
gives the minimum amount of time that the power supply should be at typical V
CC
values until the first memory access can be performed.
9. At any given temperature and voltage condition, t
HZCE
is less than t
LZCE
, t
HZOE
is less than t
LZOE
, and t
HZWE
is less than t
LZWE
for any given device.
10. t
HZOE
, t
HZCE
, and t
HZWE
are specified with C
L
= 5 pF as in part (b) of Figure 3 on page 5. Transition is measured 200 mV from steady-state voltage.
11. This parameter is guaranteed by design and is not tested.
12. The internal write time of the memory is defined by the overlap of CE
LOW and WE LOW. Both signals must be LOW to initiate a write and either signal can terminate a write
by going HIGH. The data input setup and hold timing should be referenced to the rising edge of the signal that terminates the write.
13. The minimum write cycle time for Write Cycle No. 3 (WE
controlled, OE LOW) is the sum of t
HZWE
and t
SD
.
CY7C199D
Document Number: 38-05471 Rev. *L Page 8 of 15
Switching Waveforms
Figure 5. Read Cycle No. 1: Address Transition Controlled
[14, 15]
Figure 6. Read Cycle No. 2 OE Controlled
[15, 16]
ADDRESS
DATA OUT
PREVIOUS DATA VALID
DATA VALID
t
RC
t
AA
t
OHA
50%
50%
DATA VALID
t
RC
t
ACE
t
DOE
t
LZOE
t
LZCE
t
PU
HIGH IMPEDANCE
t
HZOE
t
HZCE
t
PD
DATA OUT
OE
CE
V
CC
SUPPLY
CURRENT
IMPEDANCE
ICC
ISB
HIGH
Notes
14. Device is continuously selected. OE
, CE = V
IL
.
15. WE
is HIGH for read cycle.
16. Address valid prior to or coincident with CE
transition LOW.
CY7C199D
Document Number: 38-05471 Rev. *L Page 9 of 15
Figure 7. Write Cycle No. 1: CE Controlled
[17, 18, 19]
Figure 8. Write Cycle No. 3 WE Controlled, OE LOW
[19, 20]
Switching Waveforms (continued)
t
WC
t
AW
t
SA
t
HA
t
HD
t
SD
t
SCE
DATA
IN
VALID
WE
DATA I/O
ADDRESS
CE
t
HD
t
SD
t
LZWE
t
SA
t
HA
t
AW
t
WC
t
HZWE
NOTE 21
DATA IO
ADDRESS
CE
WE
DATA
IN
VALID
Notes
17. The internal write time of the memory is defined by the overlap of CE
LOW and WE LOW. Both signals must be LOW to initiate a write and either signal can terminate
a write by going HIGH. The data input setup and hold timing should be referenced to the rising edge of the signal that terminates the write.
18. Data I/O is high impedance if OE
= V
IH
.
19. If CE
goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state.
20. The minimum write cycle time for Write Cycle No. 3 (WE
controlled, OE LOW) is the sum of t
HZWE
and t
SD
.
21. During this period the I/Os are in the output state and input signals should not be applied.

CY7C199D-10VXI

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
SRAM 256Kb 10ns 32K x 8 SRAM
Lifecycle:
New from this manufacturer.
Delivery:
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