LTC4309
13
4309fa
Figure 6. The LTC4309 in a Level Shifting Repeater/Bus Extender Application.
SDAIN
SCLIN
DISCEN
ENABLE
READY
FAULT
SDAOUT
SCLOUT
C1
0.01μF
C2
0.01μF
LTC4309
V
CC
V
CC2
GND
3.3V
SDA1
2.5V
SCL1
R3
10k
R2
10k
R4
10k
R1
10k
SDAIN
SCLIN
DISCEN
ENABLE
READY
FAULT
SDAOUT
SCLOUT
C4
0.01μF
C3
0.01μF
LTC4309
V
CC
V
CC2
GND
5V
SDA2
SCL2
R8
10k
R9
10k
R7
10k
R10
10k
R5
2.7k
R6
2.7k
4309 F04
ACC ACC
V
CC2
SDAIN
SCLIN
FAULT
READY
ENABLE
SDA
SCL
FAULT
READY
ENA1
DISCEN
SDAOUT
SCLOUT
ACC
C1
0.01μF
R5
10k
R1
10k
V
CC
V
CC2
BACKPLANE
CONNECTOR
BACKPLANE
CARD
CONNECTORS
ENAN
R2
10k
R3
10k
R4
10k
R10
10k
R6
10k
I/O PERIPHERAL CARD 1
LTC4309
V
CC
GND
LTC4309
V
CC
GND
CARD 1_SDA
CARD 1_SCL
V
CC2
SDAIN
SCLIN
FAULT
READY
ENABLE
DISCEN
SDAOUT
SCLOUT
ACC
R7
10k
C4
0.01μF
C3
0.01μF
C2
0.01μF
R8
10k
R9
10k
I/O PERIPHERAL CARD N
CARD N_SDA
CARD N_SCL
4309 F01
Figure 5. The LTC4309 in an Application Where All the Pins Have the Same Length.
APPLICATIONS INFORMATION
LTC4309
14
4309fa
Figure 8. The LTC4309 in a level shifting application where the bus supplies are different from V
CC
.
4309 F06
SDAIN
SCLIN
DISCEN
ENABLE
READY
FAULT
SDAOUT
SCLOUT
C2
0.01μF
LTC4309
V
CC
V
CC2
GND
5V
2.5V
SDA2
SCL2
SDA1
SCL1
R4
10k
R5
10k
R3
10k
R6
10k
R1
2.7k
R2
2.7k
ACC
3.3V
Figure 7. The LTC4309 in a Repeater Application. The LTC4309’s Low Offset Allows Cascading of Multiple Devices.
4309 F05
SDAIN
SCLIN
DISCEN
ENABLE
READY
FAULT
SDAOUT
SCLOUT
C1
0.01MF
C2
0.01MF
LTC4309
V
CC
V
CC2
GND
V
CC
SDA1
SCL1
R3
10k
R2
2.7k
R4
10k
SDAIN
SCLIN
DISCEN
ENABLE
READY
FAULT
SDAOUT
SCLOUT
C5
0.01MF
LTC4309
V
CC
V
CC2
GND
R11
10k
R12
10k
R1
2.7k
SDAIN
SCLIN
DISCEN
ENABLE
READY
FAULT
SDAOUT
SCLOUT
C4
0.01MF
C3
0.01MF
C6
0.01MF
LTC4309
V
CC
V
CC2
GND
SDA2
SCL2
R8
10k
R9
2.7k
R7
10k
R10
2.7k
R13
2.7k
R14
2.7k
R5
2.7k
R6
2.7k
V
CC
ACCACCACC
APPLICATIONS INFORMATION
LTC4309
15
4309fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However,
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that
the interconnection of its circuits as described herein will not infringe on existing patent rights.
GN16 (SSOP) 0204
12
3
4
5
6
7
8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16
15
14
13
.189 – .196*
(4.801 – 4.978)
12 11 10
9
.016 – .050
(0.406 – 1.270)
.015
p .004
(0.38 p 0.10)
s 45o
0o – 8o TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC.0165 p.0015
.045 p.005
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
4.00 p0.10
(2 SIDES)
3.00 p0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.40 p 0.10
BOTTOM VIEW—EXPOSED PAD
1.70 p 0.05
(2 SIDES)
0.75 p0.05
R = 0.115
TYP
R = 0.05
TYP
0.25 p 0.05
3.30 p0.05
(2 SIDES)
16
127
0.50
BSC
PIN 1 NOTCH
R = 0.20 OR
0.35 s 45o
CHAMFER
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(UE12/DE12) DFN 0905 REV C
0.25 p 0.05
3.30 p0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.70 p0.05
(2 SIDES)
2.20 p0.05
0.50
BSC
0.70 p0.05
3.60 p0.05
PACKAGE OUTLINE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD
FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
DE/UE Package
12-Lead Plastic DFN (4mm x 3mm)
(Reference LTC DWG # 05-08-1695)
PACKAGE DESCRIPTION

LTC4309IDE#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Interface - Signal Buffers, Repeaters Low Offset Hot Swappable Bus Buffer
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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