LT3050 Series
22
3050fa
Figure 7. Reverse Output Current
V
OUT
(V)
I
OUT
(µA)
1.0
0.3
0.6
0.7
0.8
0.9
0.4
0.5
0.1
0.2
3050 F07
0
0 1020304050
ALL PINS GROUNDED EXCEPT FOR OUT
The LT3050 IN pin withstands reverse voltages of 50V. The
device limits current fl ow to less than 300A (typically less
than 10A) and no negative voltage appears at OUT. The
device protects both itself and the load against batteries
that are plugged in backwards.
The SHDN pin cannot be driven below GND unless tied
to the IN pin. If the SHDN pin is driven below GND while
IN is powered, the output may turn on. SHDN pin logic
cannot be referenced to a negative rail.
The LT3050 incurs no damage if its output is pulled be-
low ground. If the input is left open-circuit or grounded,
APPLICATIONS INFORMATION
the output can be pulled below ground by 50V. No cur-
rent fl ows through the pass transistor from the output.
However, current fl ows in (but is limited by) the resistor
divider that sets the output voltage. Current fl ows from
the bottom resistor in the divider and from the ADJ pin’s
internal clamp through the top resistor in the divider to
the external circuitry pulling OUT below ground. If the
input is powered by a voltage source, the output sources
current equal to its current limit capability and the LT3050
protects itself by thermal limiting. In this case, grounding
the SHDN pin turns off the device and stops the output
from sourcing current.
LT3050 Series
23
3050fa
PACKAGE DESCRIPTION
DDB Package
12-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1723 Rev Ø)
2.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
0.64 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
R = 0.05
TYP
2.39 ±0.10
(2 SIDES)
3.00 ±0.10
(2 SIDES)
16
127
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0 – 0.05
(DDB12) DFN 0106 REV Ø
0.23 ± 0.05
0.45 BSC
PIN 1
R = 0.20 OR
0.25 s 45°
CHAMFER
0.25 ± 0.05
2.39 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.64 ±0.05
(2 SIDES)
1.15 ±0.05
0.70 ±0.05
2.55 ±0.05
PACKAGE
OUTLINE
0.45 BSC
LT3050 Series
24
3050fa
MSOP (MSE12) 0608 REV B
0.53 p 0.152
(.021 p .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.22 –0.38
(.009 – .015)
TYP
0.86
(.034)
REF
0.650
(.0256)
BSC
12
12 11 10 9 8 7
7
DETAIL “B”
1
6
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
0.254
(.010)
0
o – 6o TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
RECOMMENDED SOLDER PAD LAYOUT
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.845
p 0.102
(.112 p .004)
2.845 p 0.102
(.112 p .004)
4.039 p 0.102
(.159 p .004)
(NOTE 3)
1.651 p 0.102
(.065 p .004)
0.1016 p 0.0508
(.004 p .002)
123456
3.00 p 0.102
(.118 p .004)
(NOTE 4)
0.406 p 0.076
(.016 p .003)
REF
4.90 p 0.152
(.193 p .006)
DETAIL “B”
CORNER TAIL IS PART OF
THE LEADFRAME FEATURE.
FOR REFERENCE ONLY
NO MEASUREMENT PURPOSE
0.12 REF
0.35
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
p 0.127
(.035 p .005)
0.42 p 0.038
(.0165 p .0015)
TYP
0.65
(.0256)
BSC
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
MSE Package
12-Lead Plastic MSOP Exposed Die Pad
(Reference LTC DWG # 05-08-1666 Rev B)
PACKAGE DESCRIPTION

LT3050EDDB-3.3#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
LDO Voltage Regulators 100mA, Low Noise Linear Regulator with Precision Current Limit and Diagnostic Functions
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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