ISL6622IBZ-T

4
FN6470.2
October 30, 2008
Absolute Maximum Ratings Thermal Information
Supply Voltage (VCC, UVCC) . . . . . . . . . . . . . . . . . . . . . . . . . . .15V
BOOT Voltage (V
BOOT-GND
). . . . . . . . . . . . . . . . . . . . . . . . . . . .36V
Input Voltage (V
PWM
) . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 7V
UGATE. . . . . . . . . . . . . . . . . . . V
PHASE
- 0.3V
DC
to V
BOOT
+ 0.3V
V
PHASE
- 3.5V (<100ns Pulse Width, 2µJ) to V
BOOT
+ 0.3V
LGATE . . . . . . . . . . . . . . . . . . . . . . .GND - 0.3V
DC
to V
LVCC
+ 0.3V
GND - 5V (<100ns Pulse Width, 2µJ) to V
LVCC
+ 0.3V
PHASE. . . . . . . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V
DC
to 15V
DC
GND - 8V (<200ns, 10µJ) to 30V (<200ns, V
BOOT-GND
<36V)
Thermal Resistance θ
JA
(°C/W) θ
JC
(°C/W)
SOIC Package (Note 1) . . . . . . . . . . . . 100 N/A
DFN Package (Notes 2, 3). . . . . . . . . . 48 7
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range. . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Ambient Temperature Range
ISL6622IBZ, ISL6622IRZ. . . . . . . . . . . . . . . . . . . .-40°C to +85°C
ISL6622CBZ, ISL6622CRZ . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . +125°C
Supply Voltage
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.8V to 13.2V
UVCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.75V to 13.2V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θ
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2. θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. For θ
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
4. Limits should be considered typical and are not production tested.
Electrical Specifications Recommended Operating Conditions. Parameters with MIN and/or MAX limits are 100% tested at +25°C,
unless otherwise specified. Temperature limits established by characterization and are not
production tested
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
VCC SUPPLY CURRENT (Note 4)
No Load Switching Supply Current I
VCC
ISL6622CBZ and ISL6622IBZ,
f
PWM
= 300kHz, V
VCC
= 12V
-8.2-mA
I
VCC
ISL6622CRZ and ISL6622IRZ,
f
PWM
= 300kHz, V
VCC
= 12V
-6.2-mA
I
UVCC
-2.0-mA
Standby Supply Current I
VCC
ISL6622CBZ and ISL6622IBZ, PWM
Transition from 0V to 2.5V
-5.7-mA
I
VCC
ISL6622CRZ and ISL6622IRZ, PWM
Transition from 0V to 2.5V
-5-mA
I
UVCC
-0.7-mA
POWER-ON RESET
VCC Rising Threshold 6.25 6.45 6.70 V
VCC Falling Threshold 4.8 5.0 5.25 V
LVCC Rising Threshold (Note 4) -4.4- V
LVCC Falling Threshold (Note 4) -3.4- V
PWM INPUT (See “TIMING DIAGRAM” on page 6)
Input Current (Note 4) I
PWM
V
PWM
= 5V - 500 - µA
V
PWM
= 0V - -430 - µA
PWM Rising Threshold (Note 4) VCC = 12V - 3.4 - V
PWM Falling Threshold (Note 4) VCC = 12V - 1.6 - V
Three-State Lower Gate Falling Threshold (Note 4) VCC = 12V - 1.6 - V
Three-State Lower Gate Rising Threshold (Note 4) VCC = 12V - 1.1 - V
Three-State Upper Gate Rising Threshold (Note 4) VCC = 12V - 3.2 - V
ISL6622
5
FN6470.2
October 30, 2008
Three-State Upper Gate Falling Threshold (Note 4) VCC = 12V - 2.8 - V
UGATE Rise Time (Note 4) t
RU
V
VCC
= 12V, 3nF Load, 10% to 90% - 26 - ns
LGATE Rise Time (Note 4) t
RL
V
VCC
= 12V, 3nF Load, 10% to 90% - 18 - ns
UGATE Fall Time (Note 4) t
FU
V
VCC
= 12V, 3nF Load, 90% to 10% - 18 - ns
LGATE Fall Time (Note 4) t
FL
V
VCC
= 12V, 3nF Load, 90% to 10% - 12 - ns
UGATE Turn-On Propagation Delay (Note 4) t
PDHU
V
VCC
= 12V, 3nF Load, Adaptive - 20 - ns
LGATE Turn-On Propagation Delay (Note 4) t
PDHL
V
VCC
= 12V, 3nF Load, Adaptive - 10 - ns
UGATE Turn-Off Propagation Delay (Note 4) t
PDLU
V
VCC
= 12V, 3nF Load - 10 - ns
LGATE Turn-Off Propagation Delay (Note 4) t
PDLL
V
VCC
= 12V, 3nF Load - 10 - ns
Diode Braking Holdoff Time (Note 4) t
UG_OFF_DB
V
VCC
= 12V - 60 - ns
Minimum LGATE ON-Time At Diode Emulation t
LG_ON_DM
V
VCC
= 12V 230 330 450 ns
OUTPUT (Note 4)
Upper Drive Source Current I
U_SOURCE
V
VCC
= 12V, 3nF Load - 1.25 - A
Upper Drive Source Impedance R
U_SOURCE
20mA Source Current - 2.0 - Ω
Upper Drive Sink Current I
U_SINK
V
VCC
= 12V, 3nF Load - 2 - A
Upper Drive Sink Impedance R
U_SINK
20mA Sink Current - 1.35 - Ω
Lower Drive Source Current I
L_SOURCE
V
VCC
= 12V, 3nF Load - 2 - A
Lower Drive Source Impedance R
L_SOURCE
20mA Source Current - 1.35 - Ω
Lower Drive Sink Current I
L_SINK
V
VCC
= 12V, 3nF Load - 3 - A
Lower Drive Sink Impedance R
L_SINK
20mA Sink Current - 0.90 - Ω
Electrical Specifications Recommended Operating Conditions. Parameters with MIN and/or MAX limits are 100% tested at +25°C,
unless otherwise specified. Temperature limits established by characterization and are not
production tested (Continued)
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Functional Pin Description
PACKAGE PIN #
PIN
SYMBOL FUNCTIONSOIC DFN
1 1 UGATE Upper gate drive output. Connect to gate of high-side power N-Channel MOSFET.
2 2 BOOT Floating bootstrap supply pin for the upper gate drive. Connect the bootstrap capacitor between this pin and the
PHASE pin. The bootstrap capacitor provides the charge to turn on the upper MOSFET. See “Internal Bootstrap
Device” on page 8 for guidance in choosing the capacitor value.
- 3 GD_SEL This pin sets the LG drive voltage in PSI mode.
3 4 PWM The PWM signal is the control input for the driver. The PWM signal can enter three distinct states during operation,
see the three-state PWM Input section on page 6 for further details. Connect this pin to the PWM output of the
controller.
4 5 GND Bias and reference ground. All signals are referenced to this node. It is also the power ground return of the driver.
5 6 LGATE Lower gate drive output. Connect to gate of the low-side power N-Channel MOSFET.
6 7 LVCC This pin provides power for the LGATE drive. Place a high quality low ESR ceramic capacitor from this pin to GND.
- 8 UVCC This pin provides power to the upper gate drive. Its operating range is +5V to 12V. Place a high quality low ESR
ceramic capacitor from this pin to GND.
7 9 VCC Connect this pin to 12V bias supply. This pin supplies power to the upper gate in the SOIC and to the LDO for the
lower gate drive. Place a high quality low ESR ceramic capacitor from this pin to GND.
8 10 PHASE Connect this pin to the SOURCE of the upper MOSFET and the DRAIN of the lower MOSFET. This pin provides
a return path for the upper gate drive.
- 11 PAD Connect this pad to the power ground plane (GND) via thermally enhanced connection.
ISL6622
6
FN6470.2
October 30, 2008
Description
Operation and Adaptive Shoot-through Protection
Designed for high speed switching, the ISL6622 MOSFET
driver controls both high-side and low-side N-Channel FETs
from one externally provided PWM signal.
A rising transition on PWM initiates the turn-off of the lower
MOSFET (see Figure 1). After a short propagation delay
[t
PDLL
], the lower gate begins to fall. Typical fall time [t
FL
] is
provided in the “Electrical Specifications” on page 4. Following
a 25ns blanking period, adaptive shoot-through circuitry
monitors the LGATE voltage and turns on the upper gate
following a short delay time [t
PDHU
] after the LGATE voltage
drops below ~1.75V. The upper gate drive then begins to rise
[t
RU
] and the upper MOSFET turns on.
A falling transition on PWM indicates the turn-off of the upper
MOSFET and the turn-on of the lower MOSFET. A short
propagation delay [t
PDLU
] is encountered before the upper
gate begins to fall [t
FU
]. The adaptive shoot-through circuitry
monitors the UGATE-PHASE voltage and turns on the lower
MOSFET a short delay time [t
PDHL
] after the upper
MOSFET’s PHASE voltage drops below +0.8V or 40ns after
the upper MOSFET’s gate voltage [UGATE-PHASE] drops
below ~1.75V. The lower gate then rises [t
RL
], turning on the
lower MOSFET. These methods prevent both the lower and
upper MOSFETs from conducting simultaneously
(shoot-through), while adapting the dead time to the gate
charge characteristics of the MOSFETs being used.
This driver is optimized for voltage regulators with large step
down ratio. The lower MOSFET is usually sized larger
compared to the upper MOSFET because the lower MOSFET
conducts for a longer time during a switching period. The
lower gate driver is therefore sized much larger to meet this
application requirement. The 0.8Ω ON-resistance and 3A sink
current capability enable the lower gate driver to absorb the
current injected into the lower gate through the drain-to-gate
capacitor of the lower MOSFET and help prevent
shoot-through caused by the self turn-on of the lower
MOSFET due to high dV/dt of the switching node.
Advanced PWM Protocol (Patent Pending)
The advanced PWM protocol of ISL6622 is specifically
designed to work with Intersil VR11.1 controllers. When
ISL6622 detects a PSI
protocol sent by an Intersil VR11.1
controller, it turns on diode emulation and GVOT (described
in next sections) operation; otherwise, it remains in normal
CCM PWM mode.
Another unique feature of ISL6622 and other Intersil drivers
is the addition of a three-state shutdown window to the PWM
input. If the PWM signal enters and remains within the
shutdown window for a set holdoff time, the driver outputs
are disabled and both MOSFET gates are pulled and held
low. The shutdown state is removed when the PWM signal
moves outside the shutdown window. Otherwise, the PWM
rising and falling thresholds outlined in the “Electrical
Specifications” on page 4 determine when the lower and
upper gates are enabled. This feature helps prevent a
negative transient on the output voltage when the output is
shut down, eliminating the Schottky diode that is used in
some systems for protecting the load from reversed output
voltage events.
Note that the LGATE will not turn off until the diode
emulation minimum ON-time of 350ns is expired for a PWM
low to tri-level (2.5V) transition.
Diode Emulation
Diode emulation allows for higher converter efficiency under
light-load situations. With diode emulation active, the
ISL6622 detects the zero current crossing of the output
inductor and turns off LGATE. This prevents the low side
MOSFET from sinking current and ensures that
discontinuous conduction mode (DCM) is achieved. The
LGATE has a minimum ON-time of 350ns in DCM mode.
PWM
UGATE
LGATE
t
FL
t
PDHU
t
PDLL
t
RL
t
TSSHD
t
PDTS
t
PDTS
1.5V<PWM<3.2V
1.0V<PWM<2.6V
t
FU
t
RU
t
PDLU
t
PDHL
t
UG_OFF_DB
FIGURE 1. TIMING DIAGRAM
ISL6622

ISL6622IBZ-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Gate Drivers SYNCH BUCK MSFT HV DRVR VR11 1 IND 8LD
Lifecycle:
New from this manufacturer.
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